Role and Responsibilities
- Responsible for design and development of critical design and co‑optimization objectives, mixed‑signal, custom digital block and full chip level integration support.
- Build and tapeout PWF reticle design.
- Engage with scribe design team to capture advanced packaging requirements and review.
- TSV design engagement with HIG‑HBM DTPCO teams (electrical, thermal and mechanical performance).
- Create and maintain DFMEA related to advanced packaging process steps like PWF and die stacking.
- Be highly motivated with passion, detail oriented, systematic and methodical approach in IC layout design.
- Perform layout verification such as LVS/DRC/antenna, quality check and documentation.
- Ensure on‑time delivery of block‑level layouts with acceptable quality.
- Demonstrate leadership skills in planning, area/time estimation, scheduling, delegation and execution to meet project schedule and milestones in a multiple‑project environment.
- Guide junior team members in executing sub‑block‑level layouts and review their work.
- Contribute to effective project management.
- Effectively communicate with global engineering teams to assure the success of layout projects.
Qualifications and Requirements
- 8 to 15 years’ experience in analog/custom layout design in advanced CMOS process, across various technology nodes (planar, FinFET).
- Expertise in Cadence VLE/VXL and Mentor Graphical Calibre DRC/LVS.
- Hands‑on experience creating layout of critical blocks such as temperature sensor, PLL, ADC, DAC, LDO, bandgap, reference generators, charge pump, current mirrors, comparator, differential amplifier, etc.
- Experience in reticle development and full chip verification.
- Capability to automate or use AI features for fast and efficient project execution.
- Good understanding of layout fundamentals (matching, electro‑migration, latch‑up, coupling, crosstalk, IR‑drop, active and passive parasitic devices).
- Understanding of layout effects on circuit performance such as speed, capacitance, power and area.
- Excellent command and problem‑solving skills in physical verification of custom layout.
- Multiple tape‑out support experience is an added advantage.
- Experience managing multiple layout projects, ensuring quality checks at all stages of layout development.
- Excellent verbal and written communication skills.
Education
- BE or MTech in Electronic/VLSI Engineering.
Job Profile(s): Semiconductor Design Engineer 4
Relocation level: (TBD)
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.