Senior Advanced Packaging & 3D/2.5D Integration Engineer

Touchdown Labs; Die; Sur place; EUR 65 000 - 110 000; Plein temps

Résumé du poste

Touchdown Labs in France is seeking an Advanced Packaging & Heterogeneous Integration Engineer to translate device requirements into robust package architectures and qualification plans.

You will compare substrates, interposers, attach, thermal paths, and work with partners to define criteria, tests, and reliability strategies. Early-stage work focuses on defensible plans and supplier comparisons before any owned fabrication exists.

Qualifications

• Advanced packaging, substrate/interposer, die attach or bonding, and product qualification.
• Shipped or qualified an advanced package, module, or heterogeneous assembly.
• Reason about thermal, electrical, mechanical, and manufacturability tradeoffs.
• Work with substrate, assembly, test, and customer engineering teams.
• Connect package architecture to assembly capability, inspection, test, and reliability evidence.
• Experience diagnosing package defects or failures with cross-sectional, electrical, mechanical, or thermal measurements.

Responsabilités

• Define known-good-die intake, package stack, assembly, integration, tests, and rework limits.
• Translate device and system requirements into package architecture and CTQs.
• Compare substrates, interposers, attach, thermal paths, and assembly partners.
• Define incoming-die criteria, package test, reliability stresses, and failure disposition.
• Define interface and acceptance responsibilities among die supplier, assembly partner, test owner, and customer.
• Use simulations and measured samples to separate design margin from process variation.

Connaissances

Advanced packaging

Substrate/interposer

Die attach or bonding

Reliability testing

Cross-functional collaboration

Outils

Simulations

Measurement methods

Description du poste

Touchdown Labs in France is seeking an Advanced Packaging & Heterogeneous Integration Engineer to translate device requirements into robust package architectures and qualification plans.

You will compare substrates, interposers, attach, thermal paths, and work with partners to define criteria, tests, and reliability strategies. Early-stage work focuses on defensible plans and supplier comparisons before any owned fabrication exists.