Photonic Packaging Engineer: Scale-Up & Integration Leader

Quandela

Massy

Sur place

EUR 65 000 - 90 000

Plein temps

Il y a 8 jours
Générateur de candidature

Une candidature sur mesure pour ce poste — un CV personnalisé et une lettre de motivation qui correspondent directement à l’offre.

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Avantages offerts par ce poste

100% health coverage (Alan)
Company savings plan
Mobility bonus
Swile meal vouchers
Gymlib access

Résumé du poste

Quandela is seeking a hands-on Photonic Packaging Engineer to own packaging activities, improve assembly processes, and troubleshoot integration challenges across PIC design, characterization and system integration teams. You will evolve toward leading packaging development projects, coordinating with external partners and contributing to scalable packaging capabilities.

Join Quandela's Integrated Photonics team in Massy and Palaiseau to help advance packaging reliability and reproducibility for

Qualifications

  • Master's or PhD in Photonics, Physics, Engineering, Microelectronics or related fields.
  • Hands-on experience in photonic, optoelectronic or semiconductor packaging.
  • Practical experience in optical alignment, component assembly or related processes.
  • Good understanding of packaging tolerances, process development and qualification.
  • Ability to troubleshoot integration issues and develop reliable packaging solutions.
  • Professional English.

Responsabilités

  • Develop and improve photonic packaging processes and adopt robust assembly methods.
  • Qualify packaged devices and define performance metrics and acceptance criteria.
  • Collaborate with PIC design, characterization and system-integration teams.
  • Lead packaging development activities and coordinate with external partners.

Connaissances

Hands-on packaging
Optical alignment
Component assembly
Packaging tolerances
Troubleshooting
Professional English

Formation

Master's or PhD in Photonics/Physics/Engineering

Description du poste

Quandela is seeking a hands-on Photonic Packaging Engineer to own packaging activities, improve assembly processes, and troubleshoot integration challenges across PIC design, characterization and system integration teams. You will evolve toward leading packaging development projects, coordinating with external partners and contributing to scalable packaging capabilities.

Join Quandela's Integrated Photonics team in Massy and Palaiseau to help advance packaging reliability and reproducibility for

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