Quantum 3D Integration Engineer (Remote)

Alice & Bob; Aubervilliers; Hybride; EUR 70 000 - 110 000; Plein temps

Avantages offerts par ce poste

BSPCE plan

Direct IP compensation

Flexible remote policy

Résumé du poste

Alice & Bob in Aubervilliers is hiring for a Process Integration engineer to translate QPU designs into scalable 3D assembly. You will work at the crossroads of nanofabrication, assembly, and cryogenic interconnects, partnering with fabrication and packaging teams to turn concepts into reliable hardware.

The role requires a PhD or MSc in a relevant field and hands-on cleanroom experience, plus 3+ years in 3D integration, flip-chip bonding, and TSV processing.

Qualifications

• PhD or MSc in physics, materials science, electrical engineering, or microelectronics, with strong hands-on cleanroom experience
• 3+ years of demonstrated 3D integration experience, in flip-chip / bump bonding and TSV processing.
• Proven track record of developing and qualifying an integration process brick end to end — from literature survey and test-vehicle design through experiments, data analysis, and go/no-go decision
• Solid grounding in failure analysis and reliability assessment of 3D interconnects: cross-sectioning, SEM, X-ray inspection / tomography, profilometry, electrical test structures
• Understanding of superconducting QPU fabrication and of what cryogenic operation demands from materials and interfaces is a plus

Responsabilités

• Explore, identify, and benchmark the most promising 3D assembly technologies for QPUs, evaluated against the demanding constraints of superconducting circuits: material and process compatibility, microwave performance, and cryogenic reliability
• Develop and qualify our core 3D integration building blocks — airbridges, flip-chip bonding, TSV, multi-layer wiring (MLW), superconducting interconnects, and wafer-level assembly — working closely with our fabrication and packaging teams
• Design and drive integration test plans in collaboration with cross-functional teams
• Build scalable, well-documented integration procedures that will support the company as it grows
• Dive into integration issues and technical anomalies, tracking them down to their root cause and making sure everything stays aligned with our specifications and performance targets
• Be the go-to technical contact for 3D integration with our external foundries, packaging partners, and equipment vendors, working alongside our foundry partnerships expert

Connaissances

3D integration

Flip-chip / bump bonding

TSV processing

Reliability assessment

Cleanroom experience

Formation

PhD or MSc in physics, materials science, electrical engineering, or microelectronics

Description du poste

Alice & Bob in Aubervilliers is hiring for a Process Integration engineer to translate QPU designs into scalable 3D assembly. You will work at the crossroads of nanofabrication, assembly, and cryogenic interconnects, partnering with fabrication and packaging teams to turn concepts into reliable hardware.

The role requires a PhD or MSc in a relevant field and hands-on cleanroom experience, plus 3+ years in 3D integration, flip-chip bonding, and TSV processing.