Senior Packaging Engineer - IC & Photonics Packaging

Arago; Paris; Sur place; EUR 65 000 - 85 000; Plein temps

Avantages offerts par ce poste

Competitive cash compensation

Meaningful stock option plan

25 days of PTO

Résumé du poste

Arago is seeking a Senior Packaging Engineer in Paris to spearhead IC packaging initiatives from design to manufacturing. You will collaborate with diverse teams to establish supply chains and oversee the new product introduction phases for advanced devices.

The candidate should possess a Master's degree in Electrical Engineering, along with 5+ years in semiconductor packaging, and expertise in photonic packaging techniques. This role offers excellent growth opportunities and a multicultural work environment.

Qualifications

• Master's degree in Electrical Engineering or Integrated Circuits Design.
• 5+ years of experience in the semiconductor and photonic packaging industry.
• Strong expertise in photonic and optoelectronic packaging.

Responsabilités

• Design packaging solutions from initial drawings to DFM.
• Identify and manage external sub-contractors.
• Lead chip industrialization ensuring high yield.

Connaissances

Electrical Engineering expertise

5+ years in semiconductor packaging

Heterogeneous integration processes

Proficiency in thermal and mechanical simulations

Knowledge of Cadence tools

Formation

Master's degree in Electrical Engineering

Outils

Cadence Allegro Package Designer

ANSYS Mechanical

Description du poste

Arago is seeking a Senior Packaging Engineer in Paris to spearhead IC packaging initiatives from design to manufacturing. You will collaborate with diverse teams to establish supply chains and oversee the new product introduction phases for advanced devices.

The candidate should possess a Master's degree in Electrical Engineering, along with 5+ years in semiconductor packaging, and expertise in photonic packaging techniques. This role offers excellent growth opportunities and a multicultural work environment.