Advanced Packaging & Heterogeneous Integration Engineer

Touchdown Labs; Die; Sur place; EUR 65 000 - 110 000; Plein temps

Résumé du poste

Touchdown Labs in France is seeking an Advanced Packaging & Heterogeneous Integration Engineer to translate device requirements into robust package architectures and qualification plans.

You will compare substrates, interposers, attach, thermal paths, and work with partners to define criteria, tests, and reliability strategies. Early-stage work focuses on defensible plans and supplier comparisons before any owned fabrication exists.

Qualifications

• Advanced packaging, substrate/interposer, die attach or bonding, and product qualification.
• Shipped or qualified an advanced package, module, or heterogeneous assembly.
• Reason about thermal, electrical, mechanical, and manufacturability tradeoffs.
• Work with substrate, assembly, test, and customer engineering teams.
• Connect package architecture to assembly capability, inspection, test, and reliability evidence.
• Experience diagnosing package defects or failures with cross-sectional, electrical, mechanical, or thermal measurements.

Responsabilités

• Define known-good-die intake, package stack, assembly, integration, tests, and rework limits.
• Translate device and system requirements into package architecture and CTQs.
• Compare substrates, interposers, attach, thermal paths, and assembly partners.
• Define incoming-die criteria, package test, reliability stresses, and failure disposition.
• Define interface and acceptance responsibilities among die supplier, assembly partner, test owner, and customer.
• Use simulations and measured samples to separate design margin from process variation.

Connaissances

Advanced packaging

Substrate/interposer

Die attach or bonding

Reliability testing

Cross-functional collaboration

Outils

Simulations

Measurement methods

Description du poste

Open role

Advanced Packaging & Heterogeneous Integration Engineer

Why this work matters

Touchdown is engineering the manufacturing behind storage, memory systems, and other chips. This role helps turn a buyer's physical result into a qualified process or a defensible decision to use an existing supplier. Advanced packaging is our intended first fab class; no production fab is operating today.

Overview

You will translate a real device and system requirement into a package that can be assembled, measured, and qualified. Compare available substrate, interposer, attach, bonding, thermal, and test routes before proposing an owned step. Make incoming die quality, interfaces, warpage, power delivery, signal behavior, reliability, and rework explicit. The first goal is a defensible qualification plan, not a claim that a packaging line already exists.

What you will own

• Define known-good-die intake, package stack, assembly, integration, thermal/electrical tests, and rework limits.
• Translate a customer device and system requirement into package architecture and CTQs.
• Compare substrates, interposers, attach, thermal paths, and available assembly partners.
• Define incoming-die criteria, package test, reliability stress, and failure disposition.
• Define interface and acceptance responsibilities among die supplier, assembly partner, test owner, and receiving customer.
• Use simulations and measured package samples to separate design margin from process variation and assembly defects.

Technical territory

2.5D and 3D package options; chiplets and known-good die; substrates, interposers, redistribution layers, die attach and bonding; electrical and thermal paths; warpage, underfill, inspection, reliability stress, assembly yield, and test coverage.

Representative outputs

• A package qualification plan from incoming die through assembly, test, reliability, and failure disposition.
• A package stack and interface drawing with material, tolerance, and known-good-die assumptions.
• An assembly and qualification matrix tied to customer use conditions.
• A build-and-test traveler with incoming criteria, inspection points, reliability stresses, reject rules, and supplier handoffs.

What success looks like

• Package acceptance is measurable from incoming die to final test.
• The selected route beats or clearly fails against a partner baseline.
• The package route satisfies the customer's electrical, thermal, mechanical, and reliability limits on reviewable evidence.
• The team can compare partner assembly with an owned process on yield, cycle time, cost, and control.

What you bring

• Advanced packaging, substrate/interposer, die attach or bonding, and product qualification.
• Shipped or qualified an advanced package, module, or heterogeneous assembly.
• Can reason about thermal, electrical, mechanical, and manufacturability tradeoffs.
• Can work with substrate, assembly, test, and customer engineering teams.
• Ability to connect package architecture to assembly capability, inspection, test, and reliability evidence.
• Experience diagnosing package defects or failures with cross-sectional, electrical, mechanical, or thermal measurements.

Helpful experience

• Chiplets, 2.5D/3D integration, or advanced substrates
• Thermomechanical modeling and package reliability
• High-density interconnects and power delivery
• Assembly yield and test coverage
• Supplier qualification and package transfer

How the role works

• Applications are open; the exact work location, arrangement, compensation, and start date will be discussed during hiring.
• Early work can produce engineering plans and partner comparisons. Hands-on work begins only at qualified, authorized facilities.
• You will work with process, equipment, quality, test, customer, and supplier owners as the scope requires.