Senior Packaging Engineer - IC & Photonics Packaging

Arago Inc.; Paris; Sur place; EUR 60 000 - 85 000; Plein temps

Avantages offerts par ce poste

Healthcare coverage

Pension contributions

25 days of PTO

Résumé du poste

Arago Inc. in Paris is seeking a Senior Packaging Engineer to lead IC packaging initiatives, managing processes from design to manufacturing. You will collaborate with cross-functional teams and ensure successful chip industrialization.

The ideal candidate has a Master’s degree in Electrical Engineering and over 5 years of experience in the semiconductor packaging industry. The role involves both technical expertise and project management.

Competitive benefits include healthcare, stock options, and relocation support.

Qualifications

• 5+ years of experience in semiconductor and photonic packaging industry.
• Strong expertise in photonic packaging and micro-scale optical alignment.
• Experience with various bonding techniques and integration schemes.

Responsabilités

• Design packaging solutions from initial drawings to DFM.
• Manage external sub-contractors for packaging.
• Conduct failure analysis and debugging.

Connaissances

Electrical Engineering expertise

Semiconductor packaging

Proficiency in Cadence software

Thermal and mechanical simulations

Fluent English

Formation

Master's degree in Electrical Engineering or Integrated Circuits Design

Outils

Cadence Allegro Package Designer

Altium

ANSYS Mechanical

Description du poste

Arago Inc. in Paris is seeking a Senior Packaging Engineer to lead IC packaging initiatives, managing processes from design to manufacturing. You will collaborate with cross-functional teams and ensure successful chip industrialization.

The ideal candidate has a Master’s degree in Electrical Engineering and over 5 years of experience in the semiconductor packaging industry. The role involves both technical expertise and project management.

Competitive benefits include healthcare, stock options, and relocation support.