Lead III-V Photonics Process Integration Engineer

IC Resources

Auvergne-Rhône-Alpes

On-site

EUR 65,000 - 90,000

Full time

14 days+
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Job summary

IC Resources seeks an ambitious III-V Process Integration Engineer to lead the development and optimization of advanced III-V photonic fabrication processes in France. You will own end-to-end integration, combining lithography, etching, deposition, metallization and bonding into robust, scalable device fabrication flows.

You will work with device, epitaxy, fabrication and manufacturing teams to translate requirements into integrated process solutions, address yield issues, and help transition

Qualifications

  • PhD or MSc in Photonics, Semiconductor Engineering, Physics, Electrical Engineering, or related field.
  • Strong experience with III-V semiconductor processing and process integration.
  • Understanding of photonic/optoelectronic device fabrication.
  • Strong analytical and problem-solving skills.
  • Cleanroom and hands-on fabrication experience highly desirable.

Responsibilities

  • Develop and own end-to-end III-V process integration flows.
  • Integrate lithography, etching, deposition, metallization, bonding, and related processes.
  • Identify and resolve integration challenges, failure mechanisms, and yield issues.
  • Develop process splits and characterization strategies to optimize device performance.
  • Establish robust process windows and improve yield, reproducibility, and manufacturability.
  • Support the transition of processes from development into scalable manufacturing.

Skills

III-V processing
Process integration
Photonic device fabrication
Analytical skills
Cleanroom fabrication

Education

PhD or MSc in Photonics/Semiconductor/Physics/Electrical Engineering

Job description

IC Resources seeks an ambitious III-V Process Integration Engineer to lead the development and optimization of advanced III-V photonic fabrication processes in France. You will own end-to-end integration, combining lithography, etching, deposition, metallization and bonding into robust, scalable device fabrication flows.

You will work with device, epitaxy, fabrication and manufacturing teams to translate requirements into integrated process solutions, address yield issues, and help transition

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