Lead III-V Photonics Process Integration Engineer

IC Resources; Auvergne-Rhône-Alpes; Sur place; EUR 65 000 - 90 000; Plein temps

Résumé du poste

IC Resources seeks an ambitious III-V Process Integration Engineer to lead the development and optimization of advanced III-V photonic fabrication processes in France. You will own end-to-end integration, combining lithography, etching, deposition, metallization and bonding into robust, scalable device fabrication flows.

You will work with device, epitaxy, fabrication and manufacturing teams to translate requirements into integrated process solutions, address yield issues, and help transition

Qualifications

• PhD or MSc in Photonics, Semiconductor Engineering, Physics, Electrical Engineering, or related field.
• Strong experience with III-V semiconductor processing and process integration.
• Understanding of photonic/optoelectronic device fabrication.
• Strong analytical and problem-solving skills.
• Cleanroom and hands-on fabrication experience highly desirable.

Responsabilités

• Develop and own end-to-end III-V process integration flows.
• Integrate lithography, etching, deposition, metallization, bonding, and related processes.
• Identify and resolve integration challenges, failure mechanisms, and yield issues.
• Develop process splits and characterization strategies to optimize device performance.
• Establish robust process windows and improve yield, reproducibility, and manufacturability.
• Support the transition of processes from development into scalable manufacturing.

Connaissances

III-V processing

Process integration

Photonic device fabrication

Analytical skills

Cleanroom fabrication

Formation

PhD or MSc in Photonics/Semiconductor/Physics/Electrical Engineering

Description du poste

IC Resources seeks an ambitious III-V Process Integration Engineer to lead the development and optimization of advanced III-V photonic fabrication processes in France. You will own end-to-end integration, combining lithography, etching, deposition, metallization and bonding into robust, scalable device fabrication flows.

You will work with device, epitaxy, fabrication and manufacturing teams to translate requirements into integrated process solutions, address yield issues, and help transition