Quantum 3D Packaging Engineer

C12; Paris; Sur place; EUR 60 000 - 78 000; Plein temps

Avantages offerts par ce poste

Stock options (BSPCE/ESOP)

Conference trips sponsored

Dynamic international team

Swile meal vouchers

Mental health support

Training budget / Annual Learning &amp

Sabbatical leave

Office in Paris

Résumé du poste

C12 Quantum Electronics in Paris is seeking a 3D Integration Engineer to develop advanced packaging and heterogeneous integration for scalable quantum computing hardware.

You will design interconnects between quantum devices, control electronics, photonic components and cryogenic systems, while maintaining signal integrity, thermal performance, and reliability across 2.5D/3D architectures. A strong background in packaging, wafer-level integration and CAD is essential.

Qualifications

• Bachelor's or Master's in a related engineering field.
• Experience in semiconductor packaging or heterogeneous integration.
• Familiarity with wafer bonding, TSVs, flip-chip, lithography, etching, or CMP.
• Strong CAD and simulation experience.

Responsabilités

• Develop 2.5D and 3D integration architectures for quantum processors and supporting electronics.
• Design interposers, through-silicon vias, micro-bumps, hybrid bonds, redistribution layers, and chiplet interfaces.
• Integrate QPU with cryogenic CMOS, RF/microwave circuitry, photonics, MEMS, and packaging substrates.
• Perform electrical, electromagnetic, mechanical, and thermal simulations.
• Define fabrication flows and design rules with foundries, packaging partners, and internal process teams.
• Develop test vehicles and analyze data to improve yield and performance.
• Document designs, process specifications, qualification results, and technology roadmaps.
• Collaborate with quantum-device, circuit-design, cryogenic, materials, manufacturing, and systems teams.

Connaissances

Semiconductor packaging

Wafer-level integration

MEMS

Heterogeneous integration

2.5D/3D integration

Interposer design

QPU integration with cryogenic CMOS

CAD and electromagnetic simulation

Cross-functional collaboration

Thermal-structural analysis

Formation

Bachelor's or Master's degree in electrical engineering, materials science, mechanical engineering, applied physics, or related discipline

Outils

CAD software

Electromagnetic simulation tools

Multiphysics simulation

Statistical analysis tools

Semiconductor process-development tools

Description du poste

C12 Quantum Electronics in Paris is seeking a 3D Integration Engineer to develop advanced packaging and heterogeneous integration for scalable quantum computing hardware.

You will design interconnects between quantum devices, control electronics, photonic components and cryogenic systems, while maintaining signal integrity, thermal performance, and reliability across 2.5D/3D architectures. A strong background in packaging, wafer-level integration and CAD is essential.