Senior PCB Design Engineer for Fastwater Staffing

HIKINEX; Montreal; On-site; CAD 90,000 - 120,000; Full time

Job summary

A leading technology firm in Montreal seeks a Senior PCB Design Engineer to lead the design of mixed-signal PCBs for space applications. This role involves collaborating with various teams, mentoring junior members, and ensuring designs meet stringent requirements. Ideal candidates will possess a Bachelor’s in Electrical Engineering and at least 7 years of experience in PCB design, including mixed-signal and high-speed circuits.

Qualifications

• Minimum of 7 years of experience in designing various types of PCBs.
• Demonstrated expertise in mixed-signal and high-speed PCBs.
• Experience with multidisciplinary design reviews.

Responsibilities

• Lead PCB design for space applications.
• Mentor junior engineers and interns.
• Collaborate with cross-functional teams.

Skills

Leadership in PCB design

Mentoring junior team members

Analog and digital design

Circuit simulation expertise

Problem-solving skills

Education

Bachelor’s degree in electrical engineering or equivalent

Tools

SPICE

MATLAB

Python

JIRA

Job description

Role Overview

As a Senior PCB Design Engineer, you will take on a leadership position within our hardware design group. Your key duties will revolve around crafting, executing, and validating mixed-signal (Digital & RF) Printed Circuit Boards (PCBs) customized for application in satellite and other orbital systems. These applications encompass a diverse spectrum, encompassing digital control/processing, motor drive units, onboard processors, and mass-storage units, all of which utilize cutting-edge space technologies.

Key Responsibilities

• Lead the digital/analog PCB design for space environments.
• Mentor and oversee junior team members and interns in PCB design.
• Translate board-level requirements into a comprehensive design concept (incorporating architecture, I/Os, key components, power dissipation estimates, FPGA integration, software integration, etc.).
• Collaborate closely with FPGA, software, and test designers to finalize functional concepts and streamline integration.
• Complete or review the schematic capture level design.
• Identify and manage technology and design risks.
• Provide guidance to ensure Design for Manufacture/Test in space environments.
• Supervise and review design layout constraints, parts placement, manufacturing, and assembly drawings.
• Prepare or review lists of long lead items, bills of materials, and ensure parts qualifications for space.
• Conduct and review circuit simulations (using tools like SPICE, Hyperlynx, ADS, etc.) and various design analyses (e.g., worst-case scenarios, FMECA).
• Coordinate with various specialized teams (structural, thermal, packaging, manufacturing, quality assurance, etc.) to conduct necessary reviews for PCB component placement and layout.
• Oversee board assembly and manufacturing tests.
• Prepare and review various documents, including review presentations, test plans, test procedures, etc.
• Lead and guide junior team members in testing, troubleshooting, and debugging complex mixed-signal boards.
• Provide support for environmental and functional tests and validation for space missions.
• Report progress and address issues to the program lead or manager.

Required Qualifications

• Bachelor’s degree in electrical engineering, computer engineering, or equivalent field.
• Minimum of seven (7) years of experience in designing processor, digital, analog, high-speed, or mixed-signal PCBs.
• Demonstrated expertise in at least one of these areas of competence.
• Proficiency in coaching and supervising junior team members and interns.
• Experience in design architecture and handling multidisciplinary specifications and reviews (FPGA, software, mechanical, etc.).
• Proficiency in tools/software languages such as Excel spreadsheets, Python, MathCAD, Spice, Matlab, JIRA, etc.
• Strong understanding of electronic circuits and communication protocols, coupled with extensive PCB design experience.
• Knowledge of PCB manufacturing processes.
• Exposure to mechanical packaging is a valuable asset.
• Experience conducting analyses (FMECA, WCA, signal integrity, power integrity, etc.) using various tools like SPICE, ADS SiPro, Hyperlynx, etc.