Technical Marketing Engineer – 2.5D/3DIC Packaging

Siemens Mobility; Wilsonville (OR); On-site; USD 130,000 - 233,000; Full time

Job summary

Siemens Software is seeking a Technical Marketing Engineer for Advanced IC Packaging focused on 2.5D and 3DIC design flows. The role connects planning, layout, and verification tools via Tcl and Python, translating customer needs into actionable workflows.

You will create technical marketing materials and demonstrate end-to-end solutions while engaging with customers worldwide. Ideal candidates have 5+ years in 2.5D/3DIC design, experience with EDA perspectives, and strong scripting abilities.

Qualifications

• Native or near-native proficiency in English.
• 5+ years of relevant experience in 2.5D / 3DIC design, Advanced IC Packaging, or related EDA flows.
• Strong understanding of design workflows spanning planning, layout, and verification.
• Practical scripting experience using Tcl and Python to automate workflows across multiple tools.
• Ability to engage with customers in technical discussions and define use cases.
• Ability to use Linux as an end user in a business/technical environment.
• Proficiency in Microsoft Office products for business use.
• Formal academic background in Electrical Engineering, Electronics, or related technical field.

Responsibilities

• Develop and deliver technical marketing materials such as videos, presentations, and lab/demo content for Advanced IC Packaging solutions.
• Build and demonstrate solution workflows for 2.5D and 3DIC design by connecting planning, layout, and verification tools using Tcl and Python.
• Engage customers in technical discussions to understand design challenges, workflow gaps, and use-case requirements.
• Translate customer technical requirements and business needs into actionable input for development teams.
• Understand newly developed products and enhancement features and communicate their value and applicability to customers.
• Support the definition and evolution of solution concepts addressing current and future customer workflows.
• Collaborate with internal teams across product, development, and field organizations to align solutions with market needs.

Job description

Siemens Software is seeking a Technical Marketing Engineer for Advanced IC Packaging focused on 2.5D and 3DIC design flows. The role connects planning, layout, and verification tools via Tcl and Python, translating customer needs into actionable workflows.

You will create technical marketing materials and demonstrate end-to-end solutions while engaging with customers worldwide. Ideal candidates have 5+ years in 2.5D/3DIC design, experience with EDA perspectives, and strong scripting abilities.