Technical Marketing Engineer: 2.5D/3DIC Packaging Solutions

ISU Research Park; Ames, Northern (IA, KY); Hybrid; USD 100,000 - 140,000; Full time

Job summary

Siemens EDA is seeking a Technical Marketing Engineer Advanced IC Packaging to drive technical marketing and solution development for 2.5D/3DIC flows. You will connect planning, layout, and verification tools with Tcl and Python, engaging customers in technical discussions to define compelling use cases.

The role demands deep knowledge of Advanced IC Packaging, strong scripting skills, and the ability to translate customer needs into actionable development input.

Qualifications

• Native or near-native proficiency in English.
• 5+ years of experience in 2.5D / 3DIC design, Advanced IC Packaging, or related flows.
• Strong understanding of design workflows spanning planning, layout, and verification.
• Practical scripting experience using Tcl and Python to automate or integrate workflows across multiple tools.
• Ability to engage directly with customers in technical discussions and help define solution use cases.
• Ability to use Linux as an end user in a business or technical environment.
• Proficiency in Microsoft Office products for business use.
• Formal academic background in Electrical Engineering, Electronics, or a related technical field.

Responsibilities

• Develop and deliver technical marketing materials such as videos, presentations, and lab/demo content for Advanced IC Packaging solutions.
• Build and demonstrate solution workflows for 2.5D and 3DIC design by connecting multiple tools, including planning, layout, and verification tools, using Tcl and Python.
• Engage customers in technical discussions to understand design challenges, workflow gaps, and use-case requirements.
• Translate customer technical requirements and related business needs into actionable input for development teams.
• Understand newly developed products and enhancement features, and communicate their technical value and applicability to customers.
• Support the definition and evolution of solution concepts that address current and future customer workflows.
• Collaborate with internal teams across product, development, and field organizations to align solutions with market needs.

Skills

2.5D design

3DIC design

Tcl scripting

Python scripting

Customer engagement

Linux OS

Advanced IC Packaging

Microsoft Office

Education

Electrical Engineering or related technical field

Tools

Microsoft Office

Job description

Siemens EDA is seeking a Technical Marketing Engineer Advanced IC Packaging to drive technical marketing and solution development for 2.5D/3DIC flows. You will connect planning, layout, and verification tools with Tcl and Python, engaging customers in technical discussions to define compelling use cases.

The role demands deep knowledge of Advanced IC Packaging, strong scripting skills, and the ability to translate customer needs into actionable development input.