Technical Marketing Engineer Advanced IC Packaging

Siemens EDA (Siemens Digital Industries Software)

Wilsonville (OR)

On-site

USD 110,000 - 160,000

Full time

33 hours ago
Be an early applicant
Application generator

Stand out for this role — generate a tailored resume and cover letter in about a minute.

Get past ATS filters

Job summary

Siemens EDA is seeking a Technical Marketing Engineer to drive marketing and solution development for EBS-centered offerings in Advanced IC Packaging, focusing on 2.5D and 3DIC design flows. You will connect planning, layout, and verification tools with Tcl and Python, engaging customers in technical discussions and shaping future workflows.

Ideal candidates have strong Linux skills, 5+ years in IC packaging or EDA, and a degree in Electrical Engineering or related field, with proven scripting

Qualifications

  • Native or near-native English proficiency.
  • 5+ years in 2.5D/3DIC design or Advanced IC Packaging.
  • Scripting experience with Tcl and Python to automate workflows.
  • Linux proficiency as an end user.
  • Microsoft Office proficiency.
  • Formal academic background in Electrical Engineering or related field.

Responsibilities

  • Develop and deliver technical marketing materials such as videos, presentations, and lab/demo content for Advanced IC Packaging solutions.
  • Build and demonstrate solution workflows for 2.5D and 3DIC design by connecting multiple tools using Tcl and Python.
  • Engage customers in technical discussions to understand design challenges, workflow gaps, and use-case requirements.
  • Translate customer requirements into actionable input for development teams.
  • Understand new product features and communicate their value and applicability to customers.
  • Support the evolution of solution concepts addressing current and future workflows.
  • Collaborate with product, development, and field teams to align solutions with market needs.

Skills

English fluency
2.5D/3DIC design
Python scripting
Tcl scripting

Education

Electrical Engineering or related field

Tools

Linux
Microsoft Office
Tcl
Python

Job description

Siemens EDA is a global technology leader in Electronic Design Automation software. Our software tools enable companies around the world to develop highly innovative electronic products faster and more cost-effectively. Our customers use our tools to push the boundaries of technology and physics to deliver better products in the increasingly complex world of chip, board, and system design.

Position Summary

The Technical Marketing Engineer is responsible for driving technical marketing and solution development for EBS-centered offerings in the area of Advanced IC Packaging, with particular focus on 2.5D and 3DIC design flows. This role requires the ability to understand customer challenges and use cases, and to translate them into solution-oriented workflows by connecting planning, layout, and verification tools using scripting technologies such as Tcl and Python. The ideal candidate will be able to engage customers in technical discussions, articulate solution value, and help shape future workflow directions, including emerging approaches that may involve agent-based technologies.

Key Responsibilities
  • Develop and deliver technical marketing materials such as videos, presentations, and lab/demo content for Advanced IC Packaging solutions.
  • Build and demonstrate solution workflows for 2.5D and 3DIC design by connecting multiple tools, including planning, layout, and verification tools, using Tcl and Python.
  • Engage customers in technical discussions to understand design challenges, workflow gaps, and use-case requirements.
  • Translate customer technical requirements and related business needs into actionable input for development teams.
  • Understand newly developed products and enhancement features, and communicate their technical value and applicability to customers.
  • Support the definition and evolution of solution concepts that address current and future customer workflows.
  • Collaborate with internal teams across product, development, and field organizations to align solutions with market needs.
Accountability / Expected Contributions
  • Understand the goals of each assigned project and the role expected within that project.
  • Proactively drive assigned responsibilities to support successful project execution and achievement of business objectives.
  • Take ownership of deliverables and contribute effectively in project-based activities.
  • Help identify and shape future solution opportunities based on customer engagement and market direction.
Required Qualifications
  • Native or near-native proficiency in English.
  • 5+ years of relevant experience in 2.5D / 3DIC design, Advanced IC Packaging, or technically supporting such flows from an EDA perspective.
  • Strong understanding of design workflows spanning planning, layout, and verification.
  • Practical scripting experience using Tcl and Python to automate or integrate workflows across multiple tools.
  • Ability to engage directly with customers in technical discussions and help define solution use cases.
  • Ability to use Linux as an end user in a business or technical environment.
  • Proficiency in Microsoft Office products for business use.
  • Formal academic background in Electrical Engineering, Electronics, or a related technical field.
Preferred Qualifications
  • Experience in technical marketing, application engineering, solution engineering, or other customer-facing technical roles.
  • Experience creating technical demonstrations, proof-of-concept workflows, or presentation materials.
  • Familiarity with EDA solution positioning for semiconductor or packaging design customers.
  • Interest in emerging workflow technologies, including AI- or agent-assisted solution approaches.
Travel Requirements
  • Customer visits are required.
  • Domestic travel will be the primary travel requirement.
  • International travel may also be required occasionally.
Work Environment / Additional Considerations
  • This role requires collaboration with teams in Asia and Europe.
  • As a result, work may occasionally take place during early morning or evening hours to accommodate global collaboration.

This position will be subject to U.S. export control requirements under the International Traffic in Arms Regulations (ITAR) and/or Export Administration Regulations (EAR). Employment is contingent on either verifying the U.S. Person status or obtaining any necessary export license.

Why us?

Working at Siemens Software means flexibility - Choosing between working at home and the office at other times is the norm here. We offer great benefits and rewards, as you'd expect from a world leader in industrial software. A collection of over 377,000 minds building the future one day at a time in over 200 countries. We're dedicated to equality, and we welcome applications that reflect the diversity of the communities we work in. All employment decisions at Siemens are based on qualifications, merit, and business need. Bring your curiosity and creativity and help us shape tomorrow!

Siemens Software.

Transform the Everyday with Us

129,600 233,300 5-10

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Technical Marketing Engineer Advanced IC Packaging
Technical Marketing Engineer Advanced IC Packaging

Siemens AG • Wilsonville (OR)

Hybrid
USD 130,000 - 233,000
Senior Director, Technical Business Development - 3DIC & Advanced Packaging
Senior Director, Technical Business Development - 3DIC & Advanced Packaging

Siemens EDA (Siemens Digital Industries Software) • Santa Clara (CA)

Hybrid
USD 275,000 - 549,000
3D-IC Application Engineer
3D-IC Application Engineer

Siemens EDA (Siemens Digital Industries Software) • San Diego (TX)

On-site
USD 120,000 - 150,000
3D-IC Application Engineer
3D-IC Application Engineer

Siemens EDA (Siemens Digital Industries Software) • Fremont (CA)

Hybrid
USD 120,000 - 180,000
3D-IC Application Engineer
3D-IC Application Engineer

Siemens EDA (Siemens Digital Industries Software) • Boulder (CO)

On-site
USD 110,000 - 150,000
3D-IC Application Engineer
3D-IC Application Engineer

Siemens EDA (Siemens Digital Industries Software) • Wilsonville (OR)

On-site
USD 90,000 - 130,000
3D-IC Application Engineer
3D-IC Application Engineer

Siemens EDA (Siemens Digital Industries Software) • Austin (TX)

On-site
USD 90,000 - 150,000
Senior Director, Technical Business Development - 3DIC & Advanced Packaging
Senior Director, Technical Business Development - 3DIC & Advanced Packaging

Siemens AG • Boulder (CO)

Hybrid
USD 274,000 - 550,000
Flexible working options
Comprehensive benefits package
Technical Marketing Engineer - 2.5D/3DIC Packaging Solutions
Technical Marketing Engineer - 2.5D/3DIC Packaging Solutions

Siemens EDA (Siemens Digital Industries Software) • Wilsonville (OR)

On-site
USD 110,000 - 160,000
Product Marketing Manager 3D IC
Product Marketing Manager 3D IC

Siemens EDA (Siemens Digital Industries Software) • Boston (TX)

Hybrid
USD 154,000 - 278,000
Work from home
Office flexibility
Travel opportunities
+1