Technical Marketing Engineer Advanced IC Packaging

ISU Research Park; Ames, Northern (IA, KY); Hybrid; USD 100,000 - 140,000; Full time

Job summary

Siemens EDA is seeking a Technical Marketing Engineer Advanced IC Packaging to drive technical marketing and solution development for 2.5D/3DIC flows. You will connect planning, layout, and verification tools with Tcl and Python, engaging customers in technical discussions to define compelling use cases.

The role demands deep knowledge of Advanced IC Packaging, strong scripting skills, and the ability to translate customer needs into actionable development input.

Qualifications

• Native or near-native proficiency in English.
• 5+ years of experience in 2.5D / 3DIC design, Advanced IC Packaging, or related flows.
• Strong understanding of design workflows spanning planning, layout, and verification.
• Practical scripting experience using Tcl and Python to automate or integrate workflows across multiple tools.
• Ability to engage directly with customers in technical discussions and help define solution use cases.
• Ability to use Linux as an end user in a business or technical environment.
• Proficiency in Microsoft Office products for business use.
• Formal academic background in Electrical Engineering, Electronics, or a related technical field.

Responsibilities

• Develop and deliver technical marketing materials such as videos, presentations, and lab/demo content for Advanced IC Packaging solutions.
• Build and demonstrate solution workflows for 2.5D and 3DIC design by connecting multiple tools, including planning, layout, and verification tools, using Tcl and Python.
• Engage customers in technical discussions to understand design challenges, workflow gaps, and use-case requirements.
• Translate customer technical requirements and related business needs into actionable input for development teams.
• Understand newly developed products and enhancement features, and communicate their technical value and applicability to customers.
• Support the definition and evolution of solution concepts that address current and future customer workflows.
• Collaborate with internal teams across product, development, and field organizations to align solutions with market needs.

Skills

2.5D design

3DIC design

Tcl scripting

Python scripting

Customer engagement

Linux OS

Advanced IC Packaging

Microsoft Office

Education

Electrical Engineering or related technical field

Tools

Microsoft Office

Job description

Technical Marketing Engineer Advanced IC Packaging

Siemens EDA is a global technology leader in Electronic Design Automation software. Our software tools enable companies around the world to develop highly innovative electronic products faster and more cost-effectively. Our customers use our tools to push the boundaries of technology and physics to deliver better products in the increasingly complex world of chip, board, and system design.

Position Summary

The Technical Marketing Engineer is responsible for driving technical marketing and solution development for EBS-centered offerings in the area of Advanced IC Packaging , with particular focus on 2.5D and 3DIC design flows .

This role requires the ability to understand customer challenges and use cases, and to translate them into solution-oriented workflows by connecting planning, layout, and verification tools using scripting technologies such as Tcl and Python . The ideal candidate will be able to engage customers in technical discussions, articulate solution value, and help shape future workflow directions, including emerging approaches that may involve agent-based technologies .

Key Responsibilities

Develop and deliver technical marketing materials such as videos, presentations, and lab/demo content for Advanced IC Packaging solutions.

Build and demonstrate solution workflows for 2.5D and 3DIC design by connecting multiple tools, including planning, layout, and verification tools, using Tcl and Python .

Engage customers in technical discussions to understand design challenges, workflow gaps, and use-case requirements.

Translate customer technical requirements and related business needs into actionable input for development teams.

Understand newly developed products and enhancement features, and communicate their technical value and applicability to customers.

Support the definition and evolution of solution concepts that address current and future customer workflows.

Collaborate with internal teams across product, development, and field organizations to align solutions with market needs.

Accountability / Expected Contributions

Understand the goals of each assigned project and the role expected within that project.

Proactively drive assigned responsibilities to support successful project execution and achievement of business objectives.

Take ownership of deliverables and contribute effectively in project-based activities.

Help identify and shape future solution opportunities based on customer engagement and market direction.

Required Qualifications

Native or near-native proficiency in English .

5+ years of relevant experience in 2.5D / 3DIC design , Advanced IC Packaging , or technically supporting such flows from an EDA perspective.

Strong understanding of design workflows spanning planning, layout, and verification .

Practical scripting experience using Tcl and Python to automate or integrate workflows across multiple tools.

Ability to engage directly with customers in technical discussions and help define solution use cases.

Ability to use Linux as an end user in a business or technical environment.

Proficiency in Microsoft Office products for business use.

Formal academic background in Electrical Engineering, Electronics, or a related technical field .

Preferred Qualifications

Experience in technical marketing, application engineering, solution engineering, or other customer-facing technical roles.

Experience creating technical demonstrations, proof-of-concept workflows, or presentation materials.

Familiarity with EDA solution positioning for semiconductor or packaging design customers.

Interest in emerging workflow technologies, including AI- or agent-assisted solution approaches.

Travel Requirements

Customer visits are required.

Domestic travel will be the primary travel requirement.

International travel may also be required occasionally.

Work Environment / Additional Considerations

This role requires collaboration with teams in Asia and Europe .

As a result, work may occasionally take place during early morning or evening hours to accommodate global collaboration.