3D IC Applications Engineer – Hybrid & Global Travel

Siemens EDA (Siemens Digital Industries Software); Austin (TX); On-site; USD 90,000 - 150,000; Full time

Job summary

Siemens EDA Technology Solutions Sales is seeking an Applications Engineer to support consultative sales, deliver technical presentations, and run product demonstrations for leading semiconductor manufacturers. You will help architect flows and prototype Siemens EDA’s 3DIC solutions while coordinating with global peers.

The role requires an MS/BS in engineering with 4+ years in IC/package layout design, proficiency with Cadence SiP/Xpedition, Verilog/LEF/DEF, scripting in Python or Tcl, and

Qualifications

• MS/BS in engineering with 4+ years of design experience.
• Experience in IC Package layout and/or interposer layout design.
• Knowledge of IC data formats (Verilog, LEF/DEF, GDS).
• Familiarity with package/interposer planning solutions and 2.5D/3D IC design.
• Strong problem-solving and scripting ability in Python/Tcl/VBScript.

Responsibilities

• Deliver technical presentations and product demonstrations to customers.
• Develop flows and prototype Siemens EDA’s emerging 3DIC solutions.
• Assist in solution development and account strategies to gain market share.
• Coordinate with global peers and support consultative sales efforts.

Skills

IC Package Design

2.5D/3D IC design

Verilog/LEF/DEF

Scripting: Python/Tcl/VBScript

Windows/Linux knowledge

Education

MS/BS in Electrical Engineering or related

Tools

Cadence APD/SiP

Siemens Xpedition/i3DL

Cadence OrbitIO/ISP

Synopsys 3DIC Compiler

HyperLynx

Sigrity

Excel

Job description

Siemens EDA Technology Solutions Sales is seeking an Applications Engineer to support consultative sales, deliver technical presentations, and run product demonstrations for leading semiconductor manufacturers. You will help architect flows and prototype Siemens EDA’s 3DIC solutions while coordinating with global peers.

The role requires an MS/BS in engineering with 4+ years in IC/package layout design, proficiency with Cadence SiP/Xpedition, Verilog/LEF/DEF, scripting in Python or Tcl, and