Technical Marketing Engineer, IC Packaging (2.5D/3DIC)

Siemens AG; Wilsonville (OR); Hybrid; USD 130,000 - 233,000; Full time

Job summary

Siemens AG, a global leader in Electronic Design Automation, seeks a Technical Marketing Engineer focused on Advanced IC Packaging (2.5D/3DIC). You will connect planning, layout, and verification tools with Tcl and Python to turn customer challenges into efficient workflows.

You will develop marketing materials, build demonstrable workflows, and engage customers in technical discussions to define use cases and drive product direction across Asia and Europe, with occasional early morning or

Qualifications

• Native or near-native English proficiency.
• 5+ years of experience in 2.5D/3DIC design or Advanced IC Packaging.
• Strong understanding of planning, layout, and verification workflows.
• Scripting experience with Tcl and Python to automate workflows.
• Ability to engage customers in technical discussions.
• Experience using Linux as an end user.
• Proficiency with Microsoft Office applications.
• Formal academic background in Electrical Engineering or related field.

Responsibilities

• Develop and deliver technical marketing materials for Advanced IC Packaging solutions.
• Build and demonstrate solution workflows for 2.5D and 3DIC design using Tcl/Python.
• Engage customers to understand design challenges and use-case requirements.
• Translate customer needs into actionable input for development teams.
• Understand new products and communicate their value to customers.
• Support definition and evolution of solution concepts addressing workflows.
• Collaborate with product, development, and field teams to align solutions with market needs.

Skills

English proficiency

5+ years 2.5D/3DIC

EDA workflows

Planning workflows

Tcl scripting

Python scripting

Linux

Microsoft Office

Electrical Engineering

Education

Electrical Engineering degree

Job description

Siemens AG, a global leader in Electronic Design Automation, seeks a Technical Marketing Engineer focused on Advanced IC Packaging (2.5D/3DIC). You will connect planning, layout, and verification tools with Tcl and Python to turn customer challenges into efficient workflows.

You will develop marketing materials, build demonstrable workflows, and engage customers in technical discussions to define use cases and drive product direction across Asia and Europe, with occasional early morning or