Technical Marketing Engineer - 2.5D/3DIC Packaging Solutions

Siemens EDA (Siemens Digital Industries Software); Wilsonville (OR); On-site; USD 110,000 - 160,000; Full time

Job summary

Siemens EDA is seeking a Technical Marketing Engineer to drive marketing and solution development for EBS-centered offerings in Advanced IC Packaging, focusing on 2.5D and 3DIC design flows. You will connect planning, layout, and verification tools with Tcl and Python, engaging customers in technical discussions and shaping future workflows.

Ideal candidates have strong Linux skills, 5+ years in IC packaging or EDA, and a degree in Electrical Engineering or related field, with proven scripting

Qualifications

• Native or near-native English proficiency.
• 5+ years in 2.5D/3DIC design or Advanced IC Packaging.
• Scripting experience with Tcl and Python to automate workflows.
• Linux proficiency as an end user.
• Microsoft Office proficiency.
• Formal academic background in Electrical Engineering or related field.

Responsibilities

• Develop and deliver technical marketing materials such as videos, presentations, and lab/demo content for Advanced IC Packaging solutions.
• Build and demonstrate solution workflows for 2.5D and 3DIC design by connecting multiple tools using Tcl and Python.
• Engage customers in technical discussions to understand design challenges, workflow gaps, and use-case requirements.
• Translate customer requirements into actionable input for development teams.
• Understand new product features and communicate their value and applicability to customers.
• Support the evolution of solution concepts addressing current and future workflows.
• Collaborate with product, development, and field teams to align solutions with market needs.

Skills

English fluency

2.5D/3DIC design

Python scripting

Tcl scripting

Education

Electrical Engineering or related field

Tools

Linux

Microsoft Office

Tcl

Python

Job description

Siemens EDA is seeking a Technical Marketing Engineer to drive marketing and solution development for EBS-centered offerings in Advanced IC Packaging, focusing on 2.5D and 3DIC design flows. You will connect planning, layout, and verification tools with Tcl and Python, engaging customers in technical discussions and shaping future workflows.

Ideal candidates have strong Linux skills, 5+ years in IC packaging or EDA, and a degree in Electrical Engineering or related field, with proven scripting