Substrate Packaging R&D Engineer: Advanced Die Integration
Intel
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Benefits offered by this job
Job summary
Intel in the United States (US) Arizona, Phoenix is seeking a Packaging Research and Development Engineer to lead process and material development for scaling advanced substrate packaging technologies. The role is factory-floor focused, collaborating with equipment and material suppliers while driving disruptive innovations in embedded die packaging.
The ideal candidate will contribute to DOE-driven characterization, cross-functional teamwork, and ongoing process improvements across packaging
Qualifications
- The candidate must possess a master's degree in a relevant science/engineering field with 3+ years of experience; or a PhD with 1+ year of experience.
- Experience in mechanical/materials engineering, and packaging or heterogeneous integration is preferred.
- Strong DOE, statistics, and process development skills are expected.
Responsibilities
- Define equipment configurations, process specs, and integrated flow for new technologies.
- Plan DOEs to characterize process windows and interactions among process/equipment/materials.
- Drive improvements in yield, reliability, quality, and productivity across teams.
- Lead cross-functional groups supporting substrate technology development.
Skills
Education
Tools
Job description
Intel in the United States (US) Arizona, Phoenix is seeking a Packaging Research and Development Engineer to lead process and material development for scaling advanced substrate packaging technologies. The role is factory-floor focused, collaborating with equipment and material suppliers while driving disruptive innovations in embedded die packaging.
The ideal candidate will contribute to DOE-driven characterization, cross-functional teamwork, and ongoing process improvements across packaging
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