Global Substrate Supplier Enablement Engineer

Intel Corporation; Phoenix (AZ); On-site; USD 141,000 - 199,000; Full time

Job summary

Intel Corporation in Phoenix is seeking a Substrate Supplier Enablement Engineer to drive supplier development and qualification for advanced packaging technologies such as high density FCBGA, EMIB-T, and glass core substrates.

You will lead collaborations with suppliers and internal teams, manage readiness milestones, and contribute to achieving supply ramp goals while visiting supplier sites as needed.

Qualifications

• Bachelor's degree with 6+ years experience in Mechanical, Materials, or related field.
• Master's degree with 4+ years, or PhD with 2+ years of experience in a technical domain.
• Experience with packaging, substrates or semiconductor manufacturing.
• Experience with SPC and yield improvement; familiarity with DOE/ design of experiments.

Responsibilities

• Collaborate with suppliers and internal teams to develop substrate processes.
• Partner with supplier engineering teams to advance substrate technologies and manage interactions.
• Ensure PCS commitments are met with rigor and consistency.
• Design and implement factory technology validation and product certification plans.
• Develop micro schedules for new factory startup activities and milestones.
• Lead qualification activities and monitor ramp indicators for smooth production.

Skills

SPC

Yield improvement

Packaging substrates

Process flow

FMEA/DOE

Problem solving

Supplier management

Education

Bachelor's degree

Master's degree

PhD

Job description

Intel Corporation in Phoenix is seeking a Substrate Supplier Enablement Engineer to drive supplier development and qualification for advanced packaging technologies such as high density FCBGA, EMIB-T, and glass core substrates.

You will lead collaborations with suppliers and internal teams, manage readiness milestones, and contribute to achieving supply ramp goals while visiting supplier sites as needed.