Staff Power Packaging Engineer – Electromechanical Systems

NAVITAS SEMICONDUCTOR USA, INC.; Torrance (CA); On-site; USD 120,000 - 170,000; Full time

Job summary

Navitas Semiconductor USA, Inc. seeks a Staff Electromechanical Packaging Engineer to join our fast-growing team. You will drive chip-scale packaging and HDI substrate layout for our voltage regulator product line, collaborating with substrate layout, ASIC, and manufacturing engineers.

You should have 3+ years in microelectronics packaging and be proficient with 3D CAD tools (Creo/NX/Catia). The role requires hands-on design, drawing creation, and interaction with OSAT suppliers to move from

Qualifications

• BS in Mechanical or Electrical engineering required.
• 3+ years in microelectronics packaging.
• Experience with substrate layout and HDI organic substrates.
• Familiarity with DFx/DFM concepts.

Responsibilities

• Support chip-scale packaging design and HDI substrate layout for voltage regulator products.
• Collaborate with substrate layout, ASIC design, and manufacturing engineers.
• Create mechanical drawings for substrate fabrication and packaged parts.
• Work with OSAT suppliers to baseline processes from prototype to mass production.

Skills

3D CAD software

GD&T

Electrical schematics

Interconnect design

Thermal analysis basics

PCB design tools

Education

B.S. in EE

MS preferred

Tools

Creo

NX

Catia

Altium

Cadence

Mentor

Job description

Navitas Semiconductor USA, Inc. seeks a Staff Electromechanical Packaging Engineer to join our fast-growing team. You will drive chip-scale packaging and HDI substrate layout for our voltage regulator product line, collaborating with substrate layout, ASIC, and manufacturing engineers.

You should have 3+ years in microelectronics packaging and be proficient with 3D CAD tools (Creo/NX/Catia). The role requires hands-on design, drawing creation, and interaction with OSAT suppliers to move from