Staff Electromechanical Packaging Engineer

Navitas Semiconductor; Torrance (CA); Vor Ort; USD 90.000 - 140.000; Vollzeit

Zusammenfassung

Navitas Semiconductor is seeking a Staff Electromechanical Packaging Engineer to join a fast‑growing, collaborative team. You will drive mechanical packaging design, substrate layout, and drawings for GaNFast and GeneSiC devices, collaborating with cross‑functional teams to bring products from prototype to production.

The role requires hands‑on CAD work, familiarity with PCB tools, and an interest in DFm, thermal analysis, and tape‑out processes.

Qualifikationen

• Bachelor's degree required in Mechanical or Electrical engineering.
• 3+ years’ experience with microelectronics packaging and/or PCB design is expected.
• Knowledge of foundry processes and chip-scale assembly processes is a plus.

Aufgaben

• Support chip scale packaging design and HDI organic substrate layout for the integrated voltage regulator product line.
• Collaborate with substrate layout, ASIC design, and manufacturing engineers.
• Create mechanical drawings for substrate fabrication and packaged part assembly, and coordinate with vendors.
• Work with OSAT suppliers to establish process baselines from prototype to mass production.

Kenntnisse

Electrical design impact

3D CAD

Electrical schematics

Tape-out

DFM

Willingness to learn

PCB design tools

Thermal analysis

Ausbildung

BS in Mechanical or Electrical Eng

MS or higher degree preferred

Tools

Altium

Cadence

Mentor

Jobbeschreibung

Job Purpose

Navitas Semiconductor (Nasdaq: NVTS) is a next-generation power semiconductor leader driving innovation in gallium nitride (GaN) and high-voltage silicon carbide (SiC) technologies. Our products enable faster, more efficient power delivery across AI data centers, high-performance computing, energy and grid infrastructure, and industrial electrification.

Job Purpose

Navitas Semiconductor (Nasdaq: NVTS) is a next-generation power semiconductor leader driving innovation in gallium nitride (GaN) and high-voltage silicon carbide (SiC) technologies. Our products enable faster, more efficient power delivery across AI data centers, high-performance computing, energy and grid infrastructure, and industrial electrification.

With more than 30 years of combined expertise in wide bandgap technologies, GaNFast™ power ICs integrate GaN power, drive, control, sensing, and protection, delivering faster power delivery, higher system density, and greater efficiency. GeneSiC™ high‑voltage SiC devices leverage patented trench‑assisted planar technology to provide industry‑leading voltage capability, efficiency, and reliability for medium‑voltage grid and infrastructure applications.

We are seeking a Staff Electromechanical Packaging Engineer to join our fast‑growing, collaborative team. The ideal candidate is self‑motivated, energetic, and able to thrive in a high‑growth, innovative environment, contributing directly to technologies that are shaping the future of power electronics.

Key Responsibilities And Duties

The Electromechanical Packaging Engineer will be working with a Lead Engineer and be responsible for:

• Support chip scale packaging design and HDI organic substrate layout for integrated voltage regulator product line.
• Collaborate with substrate layout, ASIC design, and manufacturing engineers.
• Create mechanical drawings for substrate fabrication and packaged part assembly. Work with vendors for components, assembly, and test.
• Work with OSAT (Out-Source Assembly and Test) suppliers in establishing process baseline from prototype to mass production

Knowledge, Skills, Abilities, And Other Characteristics (KSAO’s)

• Understanding of how electrical design requirements impact substrate layout and interconnect selection
• Proficient with 3D mechanical CAD software (Creo, NX, Catia, etc.), generating mechanical drawings, and GD&T
• Ability to read and create electrical schematics
• Familiarity with tape out processes for wafers and substrate
• Basic understanding of Form, Fit, Function elements in design for manufacturability (DFM).
• willingness to learn new concepts and techniques and concepts
• Familiarity with PCB design tools (Altium, Cadence, Mentor, etc.) is a plus
• Basic understanding of component level thermal analysis is a plus

Qualifications

Required Qualifications

Basic

• Minimum BS in Mechanical or Electrical engineering, MS or higher-level degree preferred.
• 3+ years’ experience with microelectronics packaging, and/or PCB design

Preferred

• Knowledge of foundry processes and chip scale assembly processes