Senior Director, Power Packaging (GaN/SiC) — Equity

NAVITAS SEMICONDUCTOR USA, INC.; Raleigh (NC); On-site; USD 260,000 - 380,000; Full time

Benefits offered by this job

Equity awards

Health, dental, and vision coverage

Unlimited PTO

Job summary

Navitas Semiconductor is seeking a Senior Director, Package Design & Engineering to lead package architecture, design, development and qualification across its GaN and SiC portfolio. This leader will define the package technology roadmap and guide global engineering execution from concept through high-volume manufacturing.

The role demands deep technical expertise in power packaging and strong leadership to build a high-performing team and partner with OSATs and suppliers, delivering robust

Qualifications

• M.S. or Ph.D. in Mechanical Engineering, Electrical Engineering, Materials Science or related field.
• 15+ years of semiconductor package design, package development, assembly process engineering, or power module development, with leadership responsibility.
• Deep knowledge of power package architecture, materials, assembly, thermal/mechanical behavior, and failure mechanisms.
• Experience leading multidisciplinary and geographically distributed engineering teams.
• Hands-on experience with OSATs or outsourced manufacturing partners on development, qualification, and ramp.

Responsibilities

• Own and execute the global package design and engineering roadmap for GaN and SiC products.
• Build and lead a global organization spanning architecture, design, materials, process development, simulation, qualification, and manufacturing readiness.
• Lead package platform development from concept to high-volume manufacturing.
• Establish technical requirements, design rules, and release criteria for package and IC programs.
• Partner cross-functionally to deliver integrated product solutions.
• Engage with OSATs, material suppliers, tooling vendors, and external partners.
• Drive qualification planning to JEDEC, AEC-Q, and internal requirements.

Skills

Package design

Leadership

Cross-functional leadership

Data-driven decisions

Thermal-mechanical simulation

OSAT collaboration

Project management

Finite-element analysis

Education

M.S. or Ph.D. in Mechanical Engineering

M.S. or Ph.D. in Electrical Engineering

Materials Science

Tools

ANSYS

SolidWorks

Job description

Navitas Semiconductor is seeking a Senior Director, Package Design & Engineering to lead package architecture, design, development and qualification across its GaN and SiC portfolio. This leader will define the package technology roadmap and guide global engineering execution from concept through high-volume manufacturing.

The role demands deep technical expertise in power packaging and strong leadership to build a high-performing team and partner with OSATs and suppliers, delivering robust