Global Head of GaN/SiC Power Package Design

Navitas Semiconductor

Raleigh (NC)

On-site

USD 250,000 - 350,000

Full time

2 days ago

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Benefits offered by this job

Health insurance

Equity awards

Unlimited PTO

Job summary

Navitas Semiconductor is seeking a Senior Director of Package Design & Engineering to lead our GaN and SiC packaging initiatives. You will define roadmaps, guide global teams across architecture, materials, simulation, and manufacturing readiness, and partner with OSATs to deliver robust, cost-effective package platforms.

The role requires extensive experience in power packaging, DFMEA/DOE, and cross-functional leadership, with travel as needed to drive projects from concept through high-volume

Qualifications

MS/PhD in engineering with 15+ years in semiconductor packaging
Proven leadership of global packaging teams and OSAT partners
Experience taking package platforms from concept to high-volume production
Strong DFMEA/DOE/reliability knowledge

Responsibilities

Own global package design roadmaps for GaN/SiC products
Lead cross-functional teams across architecture, materials, and manufacturing
Drive qualification plans per JEDEC, AEC-Q where relevant
Engage with OSATs and suppliers to ensure manufacturability and cost targets
Represent Navitas in customer reviews and executive discussions

Skills

Packaging design

Power electronics

Team leadership

DFMEA

DOE

Thermal analysis

Root cause analysis

Education

MS/PhD in Engineering

Tools

ANSYS

SolidWorks

JEDEC standards

Job description

The role requires extensive experience in power packaging, DFMEA/DOE, and cross-functional leadership, with travel as needed to drive projects from concept through high-volume

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