Staff Electromechanical Packaging Engineer (GaN/SiC)

Navitas Semiconductor; Torrance (CA); On-site; USD 90,000 - 140,000; Full time

Job summary

Navitas Semiconductor is seeking a Staff Electromechanical Packaging Engineer to join a fast‑growing, collaborative team. You will drive mechanical packaging design, substrate layout, and drawings for GaNFast and GeneSiC devices, collaborating with cross‑functional teams to bring products from prototype to production.

The role requires hands‑on CAD work, familiarity with PCB tools, and an interest in DFm, thermal analysis, and tape‑out processes.

Qualifications

• Bachelor's degree required in Mechanical or Electrical engineering.
• 3+ years’ experience with microelectronics packaging and/or PCB design is expected.
• Knowledge of foundry processes and chip-scale assembly processes is a plus.

Responsibilities

• Support chip scale packaging design and HDI organic substrate layout for the integrated voltage regulator product line.
• Collaborate with substrate layout, ASIC design, and manufacturing engineers.
• Create mechanical drawings for substrate fabrication and packaged part assembly, and coordinate with vendors.
• Work with OSAT suppliers to establish process baselines from prototype to mass production.

Skills

Electrical design impact

3D CAD

Electrical schematics

Tape-out

DFM

Willingness to learn

PCB design tools

Thermal analysis

Education

BS in Mechanical or Electrical Eng

MS or higher degree preferred

Tools

Altium

Cadence

Mentor

Job description

Navitas Semiconductor is seeking a Staff Electromechanical Packaging Engineer to join a fast‑growing, collaborative team. You will drive mechanical packaging design, substrate layout, and drawings for GaNFast and GeneSiC devices, collaborating with cross‑functional teams to bring products from prototype to production.

The role requires hands‑on CAD work, familiarity with PCB tools, and an interest in DFm, thermal analysis, and tape‑out processes.