Staff Electromechanical Packaging Engineer

Navitas Semiconductor Usa; Torrance (CA); On-site; USD 135,000 - 165,000; Full time

Job summary

Navitas Semiconductor seeks a Staff Electromechanical Packaging Engineer in Torrance, CA. You will contribute to chip-scale packaging design, HDI substrates, and cross-functional collaboration with layout, ASIC design, and manufacturing teams.

The role requires a BS in mechanical or electrical engineering, 3+ years in microelectronics packaging or PCB design, and familiarity with CAD tools and thermal analysis.

Qualifications

• Minimum BS in Mechanical or Electrical engineering; MS or higher preferred.
• 3+ years' experience with microelectronics packaging and/or PCB design.
• Preferred knowledge of foundry processes and chip-scale assembly processes.

Responsibilities

• Support chip scale packaging design and HDI organic substrate layout for integrated voltage regulator product line.
• Collaborate with substrate layout, ASIC design, and manufacturing engineers.
• Create mechanical drawings for substrate fabrication and packaged part assembly; work with vendors for components, assembly, and test.
• Work with OSAT suppliers in establishing process baseline from prototype to mass production.

Skills

3D CAD

GD&T

Electrical schematics

PCB design familiarity

Thermal analysis (basic)

DFM basics

Substrate layout knowledge

Wafers/substrate familiarity

Education

BS in Mechanical or Electrical Engineering

MS or higher preferred

Tools

Creo

NX

Catia

Altium

Cadence

Mentor

PCB design tools

Job description

Job Details

Job Location: Torrance, CA 90503, Position Type: Full Time, Salary Range: $135,000.00 - $165,000.00 Salary/year, Job Purpose:

Navitas Semiconductor (Nasdaq: NVTS) is a next-generation power semiconductor leader driving innovation in gallium nitride (GaN) and high-voltage silicon carbide (SiC) technologies. Our products enable faster, more efficient power delivery across AI data centers, high-performance computing, energy and grid infrastructure, and industrial electrification.

With more than 30 years of combined expertise in wide bandgap technologies, GaNFast™ power ICs integrate GaN power, drive, control, sensing, and protection, delivering faster power delivery, higher system density, and greater efficiency. GeneSiC™ high-voltage SiC devices leverage patented trench-assisted planar technology to provide industry-leading voltage capability, efficiency, and reliability for medium-voltage grid and infrastructure applications.

We are seeking a Staff Electromechanical Packaging Engineer to join our fast-growing, collaborative team. The ideal candidate is self-motivated, energetic, and able to thrive in a high-growth, innovative environment, contributing directly to technologies that are shaping the future of power electronics.

Key Responsibilities and Duties

• Support chip scale packaging design and HDI organic substrate layout for integrated voltage regulator product line.
• Collaborate with substrate layout, ASIC design, and manufacturing engineers.
• Create mechanical drawings for substrate fabrication and packaged part assembly. Work with vendors for components, assembly, and test.
• Work with OSAT (Out-Source Assembly and Test) suppliers in establishing process baseline from prototype to mass production.

Knowledge, Skills, Abilities, and Other Characteristics (KSAO’s)

• Understanding of how electrical design requirements impact substrate layout and interconnect selection
• Proficient with 3D mechanical CAD software (Creo, NX, Catia, etc.), generating mechanical drawings, and GD&T
• Ability to read and create electrical schematics
• Familiarity with tape out processes for wafers and substrate
• Basic understanding of Form, Fit, Function elements in design for manufacturability (DFM).
• willingness to learn new concepts and techniques and concepts
• Familiarity with PCB design tools (Altium, Cadence, Mentor, etc.) is a plus
• Basic understanding of component level thermal analysis is a plus

Qualifications: Required Qualifications

Basic

• Minimum BS in Mechanical or Electrical engineering, MS or higher-level degree preferred.
• 3+ years' experience with microelectronics packaging, and/or PCB design

Preferred

• Knowledge of foundry processes and chip scale assembly processes