Staff Failure Analysis Engineer - Advanced Packaging

Qualcomm

San Diego, Northern (CA, KY)

Hybrid

USD 135,000 - 202,000

Full time

14 days+

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Job summary

Qualcomm Technologies, Inc. is seeking a Staff Failure Analysis Engineer to lead FA test interface enablement, advanced socketing, and thermal management across mobile, compute, and automotive platforms.

You will partner with Design, Yield, Reliability and external suppliers to define hardware specs, deploy socketing solutions, and drive robust fault isolation for high-pin packages and large systems.

Qualifications

  • Bachelor's degree in Electrical/Electronics Engineering or related field with 4+ years hardware experience or a higher degree with fewer years.
  • Experience supporting FA, debug activities for complex SoCs or high-pin-count devices.
  • Strong understanding of socketing, power delivery challenges, and signal integrity.

Responsibilities

  • Lead FA test interface enablement across Qualcomm product lines (Mobile, Compute, Automotive, Networking, AR/VR).
  • Plan, develop, and deploy FA hardware such as custom sockets and carrier boards for both ATE and platform testing.
  • Define viable socket/interface variants to support FA scenarios and ensure hardware readiness by Silicon on Dock (SOD).
  • Collaborate with Design, Yield, Reliability, and external suppliers to integrate FA hardware into workflows and evolve strategies.

Skills

FA hardware design
Socketing technologies
Thermal management
Electrical engineering fundamentals
Failure analysis experience

Education

Bachelor's degree in Electrical/Electronics Engineering
Master's degree in Electrical Engineering
PhD in Electrical Engineering

Job description

Qualcomm Technologies, Inc. is seeking a Staff Failure Analysis Engineer to lead FA test interface enablement, advanced socketing, and thermal management across mobile, compute, and automotive platforms.

You will partner with Design, Yield, Reliability and external suppliers to define hardware specs, deploy socketing solutions, and drive robust fault isolation for high-pin packages and large systems.

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