Staff Failure Analysis Engineer - Advanced Packaging Technologies

Qualcomm; San Diego (CA); On-site; USD 135,000 - 202,000; Full time

Benefits offered by this job

Annual discretionary bonus

RSU grants

Comprehensive benefits package

Job summary

Qualcomm Technologies, Inc. is seeking a Failure Analysis Engineer to lead FA test interfaces, advanced socketing, and thermal management solutions for EFI across mobile, compute, automotive, and other platforms.

You will enable design debug, yield improvement, and RMA analysis by developing hardware methodologies and scalable interfaces, partnering with Design, Yield, Reliability, and Product teams to meet evolving requirements.

Qualifications

• Bachelor’s degree in a related field with 4+ years of hardware engineering or related work experience.
• Master’s degree in a related field with 3+ years of hardware engineering or related work experience.
• PhD in a related field with 2+ years of hardware engineering or related work experience.

Responsibilities

• Lead FA test interface enablement across Qualcomm product lines (Mobile, Compute, Automotive, Networking, AR/VR Embedded).
• Develop and deploy FA-specific hardware such as custom sockets and carrier boards for both ATE-based and platform-based testing.
• Define and optimize the minimum viable set of socket and interface variants for comprehensive FA test scenarios (SOD readiness).
• Design, evaluate, and deploy thermal management solutions for high-power FA use cases across segments.
• Use thermal and electrical analysis tools to assess performance, reliability, and feasibility of FA hardware solutions.
• Create detailed hardware specifications and collaborate with internal teams and suppliers to integrate socketing and thermal solutions into FA workflow.
• Partner with Design, Product Engineering, Yield, and Reliability teams to align FA hardware with product requirements.
• Continuously evaluate emerging technologies and packaging trends to evolve FA interface and socketing strategies.

Skills

Electrical engineering

Hardware design

FA enablement

Test interfaces

Education

Bachelor's degree in related field

Master's degree in Electrical Engineering

PhD in related field

Tools

Socketing technologies

Thermal analysis tools

SOD (Silicon on Dock)

Job description

Company:

Qualcomm Technologies, Inc.

Job Area:

Engineering Group, Engineering Group > Hardware Engineering

General Summary:

We are seeking a highly skilled and motivated Failure Analysis Engineer to lead the development and enablement of FA test interfaces, advanced socketing, and thermal management solutions in support of Electrical Fault Isolation (EFI). This role plays a critical part in enabling design debug, yield improvement, and RMA analysis across Qualcomm’s diverse product portfolio.

With the rapid emergence of Cloud, Compute, and Automotive products featuring large package sizes, high pin counts, and advanced packaging technologies, traditional design and process flows for FA testing are increasingly challenged. The successful candidate will develop innovative hardware methodologies and FA‑specific interface solutions to ensure robust and scalable fault isolation capability for next‑generation products.

Minimum Qualifications:

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.


• Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.


• PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.

Key Responsibilities

• Lead FA test interface enablement across all Qualcomm product lines, including Mobile, Compute, Automotive, Networking, and AR/VR Embedded platforms.


• Proactively plan, develop, and deploy FA‑specific hardware such as custom sockets and carrier boards to support both ATE‑based and platform‑based testing environments.


• Define and optimize the minimum viable set of socket and interface variants required to support comprehensive FA test scenarios, ensuring hardware readiness by Silicon on Dock (SOD).


• Design, evaluate, and deploy thermal management solutions tailored to FA use cases for high‑power (high‑TDP) devices across Cloud, Compute, and Automotive segments.


• Utilize thermal and electrical analysis tools to assess performance, reliability, and feasibility of FA hardware solutions.


• Develop detailed hardware specifications and collaborate closely with internal teams and external suppliers to integrate socketing and thermal solutions into the FA workflow.


• Partner with cross‑functional teams including Design, Product Engineering, Yield, and Reliability to align FA hardware capabilities with evolving product requirements.


• Continuously evaluate emerging technologies and packaging trends to evolve FA interface and socketing strategies.

Preferred Qualifications

• Strong foundation in electrical engineering with hands‑on experience in hardware design, test interfaces, or FA enablement.


• In‑depth understanding of socketing technologies, power delivery challenges, and signal integrity for advanced semiconductor packages.


• Experience supporting FA or debug activities for complex SoCs, high‑pin‑count devices, or large advanced packages.


• Familiarity with thermal analysis and mitigation techniques for high‑power semiconductor devices.


• Ability to translate FA requirements into clear, actionable hardware specifications.


• Strong collaboration and communication skills to work effectively across multidisciplinary and global teams.

Education Requirements

• Required: Bachelor’s degree in related discipline.


• Preferred: Master’s degree in Electrical Engineering or related discipline.

Pay range and Other Compensation & Benefits:

$134,800.00 - $202,200.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales‑incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play.

EEO Employer:

Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e‑mail disability‑[e-mail] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.