Failure Analysis Lead: FA Test Interfaces & Thermal Solutions

Qualcomm; San Diego (CA); On-site; USD 135,000 - 202,000; Full time

Benefits offered by this job

Annual discretionary bonus

RSU grants

Comprehensive benefits package

Job summary

Qualcomm Technologies, Inc. is seeking a Failure Analysis Engineer to lead FA test interfaces, advanced socketing, and thermal management solutions for EFI across mobile, compute, automotive, and other platforms.

You will enable design debug, yield improvement, and RMA analysis by developing hardware methodologies and scalable interfaces, partnering with Design, Yield, Reliability, and Product teams to meet evolving requirements.

Qualifications

• Bachelor’s degree in a related field with 4+ years of hardware engineering or related work experience.
• Master’s degree in a related field with 3+ years of hardware engineering or related work experience.
• PhD in a related field with 2+ years of hardware engineering or related work experience.

Responsibilities

• Lead FA test interface enablement across Qualcomm product lines (Mobile, Compute, Automotive, Networking, AR/VR Embedded).
• Develop and deploy FA-specific hardware such as custom sockets and carrier boards for both ATE-based and platform-based testing.
• Define and optimize the minimum viable set of socket and interface variants for comprehensive FA test scenarios (SOD readiness).
• Design, evaluate, and deploy thermal management solutions for high-power FA use cases across segments.
• Use thermal and electrical analysis tools to assess performance, reliability, and feasibility of FA hardware solutions.
• Create detailed hardware specifications and collaborate with internal teams and suppliers to integrate socketing and thermal solutions into FA workflow.
• Partner with Design, Product Engineering, Yield, and Reliability teams to align FA hardware with product requirements.
• Continuously evaluate emerging technologies and packaging trends to evolve FA interface and socketing strategies.

Skills

Electrical engineering

Hardware design

FA enablement

Test interfaces

Education

Bachelor's degree in related field

Master's degree in Electrical Engineering

PhD in related field

Tools

Socketing technologies

Thermal analysis tools

SOD (Silicon on Dock)

Job description

Qualcomm Technologies, Inc. is seeking a Failure Analysis Engineer to lead FA test interfaces, advanced socketing, and thermal management solutions for EFI across mobile, compute, automotive, and other platforms.

You will enable design debug, yield improvement, and RMA analysis by developing hardware methodologies and scalable interfaces, partnering with Design, Yield, Reliability, and Product teams to meet evolving requirements.