Senior Package Systems Engineer - Multi-Physics Design

Qualcomm; San Diego (CA); On-site; USD 120,000 - 160,000; Full time

Job summary

Qualcomm Technologies, Inc. seeks a Package System Design and Technology Engineer to drive new advanced package technology development and architecture analysis from package to system level.

You will perform multi-physics simulation-driven design, select next-generation package structures, and lead cross-functional efforts to optimize package systems for high-performance devices. You will collaborate with cross-functional teams across hardware and test groups, influencing product timelines and

Qualifications

• Role requires strong background in package design and system-level analysis.
• Experience with multi-physics simulations and packaging technologies is preferred.

Responsibilities

• As a Package System Design and Technology Engineer, you will drive advanced package technology development from package to system.

Job description

Qualcomm Technologies, Inc. seeks a Package System Design and Technology Engineer to drive new advanced package technology development and architecture analysis from package to system level.

You will perform multi-physics simulation-driven design, select next-generation package structures, and lead cross-functional efforts to optimize package systems for high-performance devices. You will collaborate with cross-functional teams across hardware and test groups, influencing product timelines and