Staff Packaging Engineer - IC Packaging & Thermal Analysis

Analog Devices; Wilmington (MA); On-site; USD 113,000 - 164,000; Full time

Benefits offered by this job

Discretionary bonus

Medical, vision and dental coverage

401k

Paid vacation, holidays, and sick time

Other benefits

Job summary

Analog Devices, Inc. is seeking a senior-level packaging engineering professional to lead design, development, and qualification of advanced semiconductor packaging solutions.

The role focuses on wire-bond, flip-chip, and system-in-package platforms, with mechanical and thermal analysis guiding architecture choices and reliability planning. You will perform FEM simulations, collaborate with OSATs and suppliers, and drive process improvements to optimize yield and cost while maintaining robust

Qualifications

• PhD or Master’s in Mechanical or Electrical Engineering.
• 5+ years of hands-on semiconductor packaging experience.
• Strong understanding of IC packaging materials and their mechanical, thermal, and electrical behaviors.
• Strong knowledge of IC package structures, substrate technologies, and semiconductor assembly processes.
• Hands-on experience with major FEM tools; ANSYS experience preferred.
• Experience with FloTHERM, Sigrity, or Icepak is a plus.
• Experience with Cadence Allegro is a plus.
• Strong analytical, problem-solving, communication, and collaboration skills.

Responsibilities

• Lead the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products.
• Provide technical leadership in package mechanical and thermal analysis to support package architecture selection, design optimization, and reliability risk assessment.
• Perform mechanical simulations of IC packages and systems using FEM tools to evaluate chip-package interaction, package-board interaction, warpage, stress, and reliability risks.
• Perform component- and system-level thermal simulations for semiconductor packages using commercial simulation tools.
• Work closely with cross-functional teams to understand product and packaging requirements, identify customer needs, and resolve complex technical issues.
• Collaborate with OSAT partners, substrate suppliers, and material vendors to resolve technical issues, drive process development, optimize manufacturing processes, and improve yield.
• Work with quality and reliability teams to establish reliability criteria and qualification plans for semiconductor products across various market applications.
• Develop and maintain package design guidelines, process specifications, simulation methodologies, and technical documentation.

Skills

Analytical thinking

Problem solving

Communication

Collaboration

Education

PhD or Master’s in Mechanical or Electrical Engineering

Tools

ANSYS

FloTHERM

Sigrity

Icepak

Cadence Allegro

Job description

Analog Devices, Inc. is seeking a senior-level packaging engineering professional to lead design, development, and qualification of advanced semiconductor packaging solutions.

The role focuses on wire-bond, flip-chip, and system-in-package platforms, with mechanical and thermal analysis guiding architecture choices and reliability planning. You will perform FEM simulations, collaborate with OSATs and suppliers, and drive process improvements to optimize yield and cost while maintaining robust