Senior Package SI/PI Engineer — DDR & Memory Interfaces

Socket.dev; San Diego (CA); On-site; USD 202,000 - 302,000; Full time

Job summary

Qualcomm seeks a Package System Design and Technology Engineer to drive advanced package technology development and architecture analysis from package to system. You will perform multi-physics simulations, lab validation, and manufacturing qualification for new product introduction, interfacing with IP teams and vendors to set specifications.

You will collaborate with cross-disciplinary teams to optimize mechanical, electrical, and thermal package systems for high performance and reliability,

Qualifications

• Bachelor's or higher in an engineering field with extensive system/package design experience.
• Experience with DDR in package/PCB/system design for compute/server standards.
• Proven experience in electromagnetics and transmission line theory.

Responsibilities

• Drive IO analyses from model extraction to simulation and reporting.
• Analyze IO power distribution in product development and reference systems.
• Perform package extraction for time/frequency domain analysis and provide design guidelines.
• Document results clearly and completely.

Skills

DDR/Package Design

Electromagnetics

HFSS

Q3D

Sentinel-PSI

Clarity

SPICE ADS/Hspice

IBIS/AMI models

Matlab automation

C/C++ or Python

Education

Master's or PhD (3+/- years)

PhD in Engineering field

Tools

NDAs not listed

Job description

Qualcomm seeks a Package System Design and Technology Engineer to drive advanced package technology development and architecture analysis from package to system. You will perform multi-physics simulations, lab validation, and manufacturing qualification for new product introduction, interfacing with IP teams and vendors to set specifications.

You will collaborate with cross-disciplinary teams to optimize mechanical, electrical, and thermal package systems for high performance and reliability,