Staff Equipment Engineer – Advanced Packaging

Micron Technology, Inc.; Boise (ID); Hybrid; USD 120,000 - 180,000; Full time

Benefits offered by this job

Health benefits

Paid time off

Retirement plan

Job summary

Micron Technology, Inc. in Boise, Idaho is seeking a Staff Equipment Development Engineer to develop and optimize next-generation wafer and die equipment in the APDT team. You will drive hardware maturity, collaborate with process development, and lead cost-reduction initiatives across R&D and manufacturing.

The role requires a Master’s degree or equivalent in a technical field, 2+ years in semiconductor equipment, and experience with DOE/SPC. Preference for PhD and robotics/AI familiarity.

Qualifications

• Master’s degree or equivalent in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics or related fields.
• 2+ years of semiconductor process or equipment engineering experience.
• Understanding of post-probe and assembly process interactions.
• 2+ years experience with DOE, SPC, Defect analysis and data analysis.
• Ability to resolve complex issues through root-cause or model-based problem solving.

Responsibilities

• Develop strategies to improve Equipment maturity for FOAK hardware.
• Develop hardware roadmaps for 5+ years in post-probe wafer and die processing.
• Develop wafer and assembly equipment to meet product requirements.
• Optimize equipment to reduce cost, increase availability, and improve capability.
• Collaborate with process development teams to create innovative solutions.
• Perform root-cause and failure analysis to drive development with OEMs/vendors.
• Support equipment transfer to production facilities (travel may be required).

Skills

DOE

SPC

Root cause analysis

AI tools

Wafer processing

Equipment engineering

Education

Master's degree in Materials Science (or related field)

PhD in Engineering (preferred)

Tools

DOE tools

Overlay systems

Robotics / machine logic

Job description

Micron Technology, Inc. in Boise, Idaho is seeking a Staff Equipment Development Engineer to develop and optimize next-generation wafer and die equipment in the APDT team. You will drive hardware maturity, collaborate with process development, and lead cost-reduction initiatives across R&D and manufacturing.

The role requires a Master’s degree or equivalent in a technical field, 2+ years in semiconductor equipment, and experience with DOE/SPC. Preference for PhD and robotics/AI familiarity.