Advanced Packaging Design & Layout Engineer (AI-Driven)

Micron Technology, Inc.

Boise (ID)

Hybrid

USD 120,000 - 170,000

Full time

4 days ago

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Job summary

Micron Technology, Inc. seeks an Engineer for Advanced Packaging Development in Boise, Idaho. You will develop and refine design rules, requirements, and test structures for advanced packaging, and create layout and DBR test vehicles to support technology development.

Responsibilities include ensuring robust design rule checks, analyzing large datasets, and driving data-driven decisions. Collaborate with Process Integration, Product Engineering, Design, and Advanced Mask teams to resolve issues

Qualifications

BS/MS/PhD in Electrical Engineering, Microelectronics, Physics, or related field.
2+ years of semiconductor industry experience in Process Integration, Yield Enhancement, Product Engineering, or Design.
Strong understanding of memory process flows and TSV-based packaging.
Proficiency in Python, R, or MATLAB and EDA tools.

Responsibilities

Develop and refine Design Rules, Requirements, and Test Structures for advanced packaging.
Create layout and DBR test vehicle and product designs to support technology development.
Ensure robust Design Rule Checks (DRC) and appropriate responses to deviations.
Analyze large datasets to extract meaningful insights and drive data-driven decision-making.
Leverage AI to reduce development time and improve design margins.
Collaborate cross-functionally to resolve process issues and align rules across nodes.
Document and communicate complex problem resolutions to Process Integration, Product Engineering, Design, and Advanced Mask teams.