Staff Engineer, Advanced Packaging: Edge Trim & Backgrind

Micron Technology, Inc; Boise, Northern (ID, KY); Hybrid; USD 110,000 - 160,000; Full time

Job summary

Micron Technology, Inc. in Idaho seeks a Staff Engineer to join the Advanced Packaging Technology Development (APTD) team.

You will help develop and scale wafer edge trim, backgrind, and thinning processes for next-generation memory products, collaborating across process areas and enabling production readiness. The role emphasizes hands-on R&D, data-driven optimization, and multi-project management with potential travel.

Qualifications

• BS or MS with a minimum of 4 years of experience in wafer edge trim, backgrind, wafer thinning, CMP, or mechanical wafer processing in the semiconductor industry.
• Demonstrated R&D capability with hands-on experiments to advance wafer processing.
• Proven expertise in experimental design (DOE), data analysis, and result interpretation.
• Strong analytical and problem-solving skills for complex wafer challenges.

Responsibilities

• Develop and optimize wafer edge trim, backgrind, and thinning processes to meet mechanical, electrical, and reliability requirements of Micron's memory products.
• Improve process capability, yield, cost efficiency, and wafer integrity through data-driven optimization and equipment or consumable innovation.
• Conduct root-cause and failure-mode analyses to understand damage mechanisms and drive mitigation strategies.
• Perform fundamental research and early-stage pathfinding to enable ultra-thin wafer processing for next-generation packaging architectures.
• Support process transfer and ramp to production at manufacturing sites; travel may be required.

Skills

Edge trim

Backgrind

Wafer thinning

DOE

Data analysis

Root-cause analysis

Technical reporting

Education

BS or MS in Engineering

PhD (preferred)

Tools

MS Office

Python scripting

Job description

Micron Technology, Inc. in Idaho seeks a Staff Engineer to join the Advanced Packaging Technology Development (APTD) team.

You will help develop and scale wafer edge trim, backgrind, and thinning processes for next-generation memory products, collaborating across process areas and enabling production readiness. The role emphasizes hands-on R&D, data-driven optimization, and multi-project management with potential travel.