Staff Engineer, Edge Trim & Wafer Backgrind (APTD)

Micron Technology; Boise (ID); On-site; USD 110,000 - 150,000; Full time

Benefits offered by this job

Medical/Dental/Vision plans

Paid time off

Paid holidays

Paid family leave

Job summary

Micron Technology in Boise, Idaho seeks a senior engineer to join the Advanced Packaging Wafer Edge Trim, Backgrind & Thinning R&D team. You will develop and scale mechanical wafer processing modules, collaborating with process integration and adjacent areas to meet performance, yield, and reliability targets.

The role emphasizes hands-on experimentation, DOE design, data analysis, and rapid prototyping with opportunities to influence technology direction and long-term roadmap.

Qualifications

• BS or MS in a relevant field with hands-on wafer processing experience.
• PhD in a related field with 2+ years of industry experience is preferred.

Responsibilities

• Develop and optimize wafer edge trim, backgrind, and thinning processes to meet requirements.
• Improve process capability, yield, cost efficiency, and wafer integrity through data-driven optimization and material/tech innovations.
• Conduct root-cause and failure-mode analyses to understand damage mechanisms and drive mitigations.
• Perform fundamental research and early-stage pathfinding for ultra-thin wafer processing.
• Support process transfer and ramp to production with travel as needed.

Skills

Wafer edge trim

Backgrind

Wafer thinning

CMP

Mechanical wafer processing

DOE

Data analysis

Root cause analysis

Project management

MS Office

Data visualization

Education

BS or MS in related field

PhD in related field

Tools

Python scripting

GenAI-enabled analysis

MS Office

Job description

Micron Technology in Boise, Idaho seeks a senior engineer to join the Advanced Packaging Wafer Edge Trim, Backgrind & Thinning R&D team. You will develop and scale mechanical wafer processing modules, collaborating with process integration and adjacent areas to meet performance, yield, and reliability targets.

The role emphasizes hands-on experimentation, DOE design, data analysis, and rapid prototyping with opportunities to influence technology direction and long-term roadmap.