Staff Engineer, Advanced Packaging – AI-Driven Innovation

Micron; Boise (ID); On-site; USD 140,000 - 180,000; Full time

Benefits offered by this job

Medical, Dental, Vision plans

Paid time off

Paid holidays

Job summary

Micron Technology is seeking a seasoned design engineer to join our advanced packaging team in Idaho. You will develop design rules, test structures, and layouts to support technology development and drive robust DRC processes.

You will analyze large data sets, apply AI to shorten development cycles, and collaborate across Process Integration, Product Engineering, Design, and Advanced Mask teams. This full-time role requires 5+ years in semiconductor packaging and strong Python/MATLAB data

Qualifications

• BS/MS/PhD in Electrical Engineering, Microelectronics, Physics, or related field.
• 5+ years in semiconductor industry in Process Integration, Yield, Product Eng, or related.
• Strong knowledge of memory process flows and TSV-based packaging.
• Experience with Python, R, or MATLAB for data analysis and scripting.

Responsibilities

• Develop and refine Design Rules, Requirements, and Test Structures for advanced packaging.
• Create layout and DBR test vehicle and product designs to support technology development.
• Ensure robust Design Rule Checks (DRC) and appropriate responses to deviations.
• Analyze large datasets to extract meaningful insights and drive data-driven decision-making.
• Leverage of artificial intelligence to reduce development time.
• Manage structure evaluation to support development and quantify process margins.
• Strategically partner with teams to resolve process issues related to layout and prioritize solutions.
• Document and communicate complex problem resolutions and drive cross-node design rule alignment.
• Maintain effective communication across Process Integration, Product Engineering, Design, and Advanced Mask teams.

Skills

Python

R

MATLAB

Data analysis

Education

BS/MS/PhD in Electrical Engineering, Microelectronics, Physics, or related field

Tools

Cadence Virtuoso Layout

Schematic Editor

Calibre

HSPICE

Job description

Micron Technology is seeking a seasoned design engineer to join our advanced packaging team in Idaho. You will develop design rules, test structures, and layouts to support technology development and drive robust DRC processes.

You will analyze large data sets, apply AI to shorten development cycles, and collaborate across Process Integration, Product Engineering, Design, and Advanced Mask teams. This full-time role requires 5+ years in semiconductor packaging and strong Python/MATLAB data