Staff Engineer, Advanced Packaging & Data-Driven Dev

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 120,000 - 160,000; Full time

Job summary

Micron Technology, Inc. is seeking a senior design engineer to develop design rules, test structures for advanced packaging, and support technology development at its Boise, Idaho site.

You will analyze large datasets, apply artificial intelligence to shorten development cycles, ensure robust design rule checks, and work with cross-functional teams across Process Integration, Product Engineering, Design, and Advanced Mask groups to resolve issues.

Qualifications

• BS/MS/PhD in Electrical Engineering, Microelectronics, Physics, or related field.
• 5+ years in semiconductor industry across Process Integration, Yield Enhancement, or Design.
• Strong understanding of semiconductor memory process flows and TSV packaging.
• Hands-on experience with EDA tools such as Cadence Virtuoso and Calibre.
• Programming proficiency in Python, R, or MATLAB.
• Experience with Design Rule Characterization and silicon validation.

Responsibilities

• Develop and refine Design Rules, Requirements, and Test Structures for advanced packaging.
• Create layout and DBR test vehicle and product designs to support technology development.
• Ensure robust DRC and manage deviations.
• Analyze large datasets to drive data-driven decisions.
• Leverage AI to reduce development time.
• Collaborate with Process Integration, Product Engineering, Design, and Advanced Mask teams.
• Document and communicate complex problem resolutions and drive cross-node design rule alignment.
• Maintain effective communication across Process Integration, Product Engineering, Design, and Advanced Mask teams.

Skills

Python

R

MATLAB

Education

BS/MS/PhD in Electrical Engineering, Microelectronics, Physics, or related field

Tools

Cadence Virtuoso Layout

Cadence Virtuoso Schematic Editor

Calibre

Hspice

Job description

Micron Technology, Inc. is seeking a senior design engineer to develop design rules, test structures for advanced packaging, and support technology development at its Boise, Idaho site.

You will analyze large datasets, apply artificial intelligence to shorten development cycles, ensure robust design rule checks, and work with cross-functional teams across Process Integration, Product Engineering, Design, and Advanced Mask groups to resolve issues.