Staff CMP Process Engineer — Advanced Packaging Innovator

Micron Technology, Inc.

Boise (ID)

On-site

USD 110,000 - 170,000

Full time

9 days ago

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Job summary

Micron Technology, Inc. is seeking a Staff Process Engineer in the Advanced Packaging CMP team in Boise, Idaho. You will start up, develop, and optimize CMP processes to improve yield, quality, and reliability while addressing cost and productivity.

The role requires strong problem-solving, collaboration across regions, and adherence to IP policies. The position emphasizes cross-functional leadership, experimental design, and applying failure analysis, FMEA, 8D, or SPC/FDC methodologies, with

Qualifications

5+ years of CMP experience in the semiconductor industry.
Hands-on CMP equipment operation (AMAT LKP, EBARA-300X) and metrology tools.
Experience in dielectrics/metals CMP process development.
Understanding of integration/structural impacts related to film deposition and upstream/downstream processes.
Excellent oral and written communication skills.

Responsibilities

Perform fundamental research, consumables development, and hardware evaluation.
Initiate experiments to widen process margins and evaluate manufacturability.
Incorporate best manufacturing methods into early development phases.
Design and implement advanced process monitoring and control methodologies.
Lead complex, multi-functional projects and advise management on technical issues.
Drive innovation via patents and technical papers; use AI to improve job functions.