Advanced Packaging Process Integration Engineer

Micron Technology, Inc; Boise (ID); On-site; USD 90,000 - 120,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. seeks a Process Integration Engineer in Advanced Packaging Technology Development (APTD) to develop and integrate packaging solutions for next‑generation semiconductor products at our Boise, Idaho site.

You will collaborate with multi‑functional teams, perform process development and technology qualification, and apply data‑driven methods to improve performance. Ideal candidates hold a master's degree in a relevant field and have experience in semiconductor packaging,

Qualifications

• Master's degree or equivalent in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or related field.
• Experience with semiconductor packaging, process integration, materials engineering, device physics, or related areas.
• Demonstrated analytical and problem-solving skills through projects, internships, or research.
• Ability to collaborate in a multi-functional team and communicate complex concepts clearly.
• Experience with data analysis tools and willingness to learn AI-assisted technologies.

Responsibilities

• Support the development, characterization, and integration of packaging and interconnect solutions for next-gen semiconductor products.
• Collaborate with multi-functional teams to analyze data, solve technical challenges, and improve performance.
• Participate in experiments, process evaluations, and technology qualification activities.
• Utilize data-driven tools to identify trends and support technical decisions.
• Promote safety, quality, and continuous learning.

Skills

Data analysis

Collaboration

Problem solving

Communication

AI-assisted tools

Education

Master's degree (Electrical / Materials / Mechanical / Physics / Chemistry)

Tools

Statistical methods

Design of Experiments

Laboratory techniques

Job description

Micron Technology, Inc. seeks a Process Integration Engineer in Advanced Packaging Technology Development (APTD) to develop and integrate packaging solutions for next‑generation semiconductor products at our Boise, Idaho site.

You will collaborate with multi‑functional teams, perform process development and technology qualification, and apply data‑driven methods to improve performance. Ideal candidates hold a master's degree in a relevant field and have experience in semiconductor packaging,