Silicon Photonics Packaging Intern: 3D Co-Packaged Optics

GlobalFoundries inc.; New York (NY); Presencial; USD 28.000 - 55.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Mentorship

Professional development

Networking with executives

Descripción de la vacante

GlobalFoundries is seeking a summer 2027 intern to support the development of industry-leading electro-optical transceivers using GF's Photonix platform and advanced 2.5D and 3D co-packaged optics form factors.

This hands-on role will contribute to thermal, mechanical, electrical, and optical chip-package co-design with a focus on module performance, reliability, packaging design, materials selection, and advanced chiplet integration requirements.

Formación

• Pursuing a Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Photonics, Optical Engineering, Packaging Engineering or related field during the internship.
• Must have at least a 3.0 GPA and be in good academic standing.
• English language fluency (written & verbal).
• Travel up to 10%.
• Ability to work at least 40 hours per week during the internship.

Responsabilidades

• Support Silicon Photonics advanced packaging innovation and customer design enablement by contributing to packaging design rules, product requirements, and efficient manufacturing processes with internal teams and OSAT ecosystem partners.
• Participate in cross-functional design reviews and use engineering analysis to help resolve technical, manufacturability, reliability, and yield concerns for new customer products.
• Develop and apply analysis or simulation models to evaluate package performance, manufacturability, cost, and quality, and document findings and recommendations for engineering stakeholders.
• Contribute to qualification robustness and continuous improvement plans by applying consistent design processes, tracking requirements, and supporting product development from concept through production readiness.

Conocimientos

English fluency

Strong communication

40 hours per week

Educación

Bachelor’s or Master’s in Electrical/Mechanical/Materials/Photonics/Optical/Packaging Eng

Pursuing degree during internship

Descripción del empleo

GlobalFoundries is seeking a summer 2027 intern to support the development of industry-leading electro-optical transceivers using GF's Photonix platform and advanced 2.5D and 3D co-packaged optics form factors.

This hands-on role will contribute to thermal, mechanical, electrical, and optical chip-package co-design with a focus on module performance, reliability, packaging design, materials selection, and advanced chiplet integration requirements.