New Grad: Packaging Integration Engineer, Silicon Photonics

GLOBALFOUNDRIES U.S. INC.

Essex Junction (VT)

On-site

USD 85,000 - 146,000

Full time

14 days+

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Job summary

GlobalFoundries is seeking a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Integration Engineer. You will collaborate with cross-functional engineering teams to support development and manufacturing of electro-optical transceivers using GF’s Photonix platform and advanced 2.5D/3D packaging technologies.

The role involves package integration, process development, reliability characterization, and data analysis while gaining hands-on

Qualifications

Graduating with a Bachelor's, Master's, or PhD in a STEM field.
Overall GPA of 3.0 or higher.
Basic understanding of semiconductor packaging and related technologies.
Strong analytical and problem-solving abilities.
Experience analyzing experimental or engineering data.
Ability to work in cross-functional teams.
English language fluency (written and verbal).
Travel up to 10%.

Responsibilities

Support assembly process integration activities for silicon photonics and advanced packaging products.
Assist with process development, characterization, and qualification activities for new package technologies.
Analyze engineering data to identify process improvements.
Participate in failure analysis and root cause investigations for packaging and assembly issues.
Support package reliability testing and characterization activities.
Collaborate with design, product, manufacturing, quality, and supplier teams to address technical challenges.
Contribute to design rule development and manufacturability assessments for new products.
Document experimental results and communicate findings through presentations and technical reports.