Summer Silicon Photonics Packaging Intern

GlobalFoundries inc.; Town of Malta (NY); On-site; USD 28,000 - 55,000; Full time

Job summary

GlobalFoundries is seeking a summer 2027 intern to support the development of industry-leading electro-optical transceivers using GF's Photonix platform and advanced 2.5D and 3D co-packaged optics form factors.

This hands-on role will contribute to thermal, mechanical, electrical, and optical chip-packaging co-design with a focus on module performance, reliability, packaging design, materials selection, and advanced chiplet integration requirements.

Qualifications

• Actively pursuing a Bachelor’s or Master’s degree in Electrical, Mechanical, Materials Science, Photonics, Optical Engineering, Packaging Engineering, or related field.
• GPA of at least 3.0 and in good academic standing.
• English language fluency (written and verbal).
• Travel up to 10%.
• Willingness to work at least 40 hours per week during the internship.

Responsibilities

• Support packaging design rules, product requirements, and efficient manufacturing processes with internal teams and OSAT ecosystem partners.
• Participate in cross-functional design reviews and use engineering analysis to resolve technical, manufacturability, reliability, and yield concerns for new customer products.
• Develop and apply analysis or simulation models to evaluate package performance, manufacturability, cost, and quality, and document findings for engineering stakeholders.
• Contribute to qualification robustness and continuous improvement plans by applying design processes and tracking requirements.

Skills

English fluency

Strong communication

Education

Engineering degree fields (EE/ME/Materials/Photonics/Optical/Packaging)

Job description

GlobalFoundries is seeking a summer 2027 intern to support the development of industry-leading electro-optical transceivers using GF's Photonix platform and advanced 2.5D and 3D co-packaged optics form factors.

This hands-on role will contribute to thermal, mechanical, electrical, and optical chip-packaging co-design with a focus on module performance, reliability, packaging design, materials selection, and advanced chiplet integration requirements.