Packaging Design Integration Engineer — New Grad

GlobalFoundries; Essex Junction (VT); On-site; USD 85,000 - 146,000; Full time

Job summary

GlobalFoundries is seeking a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Design Integration Engineer. You will collaborate with experienced engineers and cross-functional teams to support chip package co-design activities for electro-optical transceivers using GF’s Photonix platform and advanced 2.5D/3D packaging technologies.

The role involves thermal, mechanical, electrical, and optical design integration, including design rule

Qualifications

• Education: Bachelor's, Master's or PhD in a STEM field from an accredited program.
• Must have at least a 3.0 GPA and good academic standing.
• Basic understanding of semiconductor packaging, silicon photonics, chip package co-design, modeling/simulation, materials science, reliability, or manufacturing processes.
• Demonstrated analytical and problem-solving skills.
• Experience analyzing experimental, simulation, or engineering data.
• Ability to work effectively within cross-functional teams.
• Language Fluency - English (Written & Verbal).
• Travel - Up to 10%.

Responsibilities

• Support packaging design integration activities for silicon photonics and advanced packaging products.
• Assist with thermal, mechanical, electrical, and optical chip package co-design analysis under guidance of experienced engineers.
• Contribute to design rule development, manufacturability assessments, and design review preparation for new package technologies.
• Use data, simulations and characterization results to evaluate options and identify improvements.
• Participate in cross-functional problem-solving on technical, yield, quality, and reliability concerns.
• Develop and document design guidelines, technical reports, and presentation materials.
• Collaborate with design, product, process integration, manufacturing, quality, and supplier teams for new customer products.
• Support continuous improvement initiatives focused on design quality, manufacturability, cost and reliability.

Skills

Analytical ability

Cross-functional teamwork

Education

Bachelors in STEM

Masters or PhD preferred

Tools

HFSS

Zemax

FloTHERM

DOE

Job description

GlobalFoundries is seeking a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Design Integration Engineer. You will collaborate with experienced engineers and cross-functional teams to support chip package co-design activities for electro-optical transceivers using GF’s Photonix platform and advanced 2.5D/3D packaging technologies.

The role involves thermal, mechanical, electrical, and optical design integration, including design rule