Packaging Design & Integration Engineer - New Graduate

GLOBALFOUNDRIES U.S. INC.; Essex Junction (VT); On-site; USD 85,000 - 146,000; Full time

Job summary

GlobalFoundries seeks a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Design Integration Engineer. You will collaborate with engineers across functions to support chip package co-design for electro-optical transceivers using GF’s Photonix platform and advanced 2.5D/3D packaging.

You will contribute to thermal, mechanical, electrical, and optical design integration, including rule development, simulation, manufacturability

Qualifications

• Bachelor’s, Master’s, or PhD in a STEM field from an accredited program.
• GPA of 3.0 or higher and strong academic standing.
• Fundamentals in semiconductor packaging, silicon photonics, co-design, modeling, reliability or manufacturing.
• Analytical thinking and data-driven problem solving.
• Ability to work across cross-functional teams and communicate in English.

Responsibilities

• Support packaging design integration for silicon photonics and advanced packaging.
• Assist with thermal, mechanical, electrical, and optical co-design analyses.
• Contribute to design rule development and manufacturability assessments.
• Use simulations and test data to compare design options and drive improvements.
• Collaborate with design, product, process, manufacturing, quality, and supplier teams.
• Participate in continuous improvement focused on quality, cost, and reliability.
• Travel up to 10% to other GF facilities as needed.

Skills

Analytical skills

Problem solving

Cross-functional teamwork

English fluency

Engineering data analysis

Education

Bachelor’s, Master’s or PhD in Mechanical Eng, Electrical Eng, Materials Sci Eng, Chemical Eng, Physics, Optical Eng, or related STEM

Tools

HFSS

Zemax

FloTHERM

FEA

Electrical/Optical simulation software

Job description

GlobalFoundries seeks a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Design Integration Engineer. You will collaborate with engineers across functions to support chip package co-design for electro-optical transceivers using GF’s Photonix platform and advanced 2.5D/3D packaging.

You will contribute to thermal, mechanical, electrical, and optical design integration, including rule development, simulation, manufacturability