Senior Thermal & Thermo-Mechanical Engineer, AI Data Center

TylSemi; San Jose (CA); Remote; USD 180,000 - 260,000; Full time

Job summary

TYLsemi, Inc. is seeking a staff-level Thermal & Thermo-Mechanical Analysis Engineer to lead the simulation, modeling, and architectural definition of AI data center hardware.

You will own end-to-end thermal integrity for high-power AI systems, working across chip, package, PCB, and system stacks, and collaborating with Silicon Architecture, Package Design, and System Hardware teams to deliver innovative cooling solutions.

Qualifications

• 5+ years in thermal and structural analysis of semiconductor packages and systems.
• Fluent with industry-standard thermal/thermo-mechanical tools (Icepak, Celsius, Star-CCM+).
• Experience modeling high-density packaging architectures (CoWoS) and data center‑class PCBs.

Responsibilities

• Lead thermal and thermo-mechanical simulations for AI workloads and data-center hardware.
• Develop high-fidelity models for silicon, interposers, packaging, and system levels.
• Collaborate with Silicon Architecture, Package Design and System Hardware teams to optimize the envelope.
• Propose and implement cooling strategies (TIMs, direct-to-chip cooling, immersion, microchannel).
• Perform CFD analyses for die, package, board, and system designs to support >1kW TDP.

Skills

Thermal analysis

Thermo-mechanical analysis

High-power AI systems

CFD

End-to-end thermal modeling

Tools

Ansys Icepak

Cadence Celsius

Star-CCM+

FLOEFD

RedHawk-SC ET

Job description

TYLsemi, Inc. is seeking a staff-level Thermal & Thermo-Mechanical Analysis Engineer to lead the simulation, modeling, and architectural definition of AI data center hardware.

You will own end-to-end thermal integrity for high-power AI systems, working across chip, package, PCB, and system stacks, and collaborating with Silicon Architecture, Package Design, and System Hardware teams to deliver innovative cooling solutions.