Senior Thermal & Mechanical Engineer – AI Silicon Packaging

Amazon Inc.; Austin (TX); Presencial; USD 154 000 - 215 000; Tempo integral

Resumo da oferta

Amazon Inc. (Annapurna Labs) is seeking a Thermal & Mechanical Engineer to design and optimize advanced semiconductor packages for data-center deployment.

You will lead finite element simulations and experiments, ensuring thermal and mechanical integrity across package stacks and systems. You will collaborate with Quality, Reliability, Package Design, Test, and System Design teams to drive robust architectures and data-driven decisions for next-generation products.

Qualificações

• Bachelor's degree in mechanical engineering or equivalent.
• 5+ years industry experience in mechanical design of semiconductor-based systems.
• 3+ years industry experience in advanced packaging of semiconductors.
• Experience designing and testing test vehicles to assess future packaging architectures.
• Proficiency with simulation tools such as ANSYS, ABAQUS, COMSOL, FLOTHERM, ICEPACK or equivalent FEA/CFD software.

Responsabilidades

• Perform finite element simulations and analytical modeling to evaluate assembly, test, and reliability risks for advanced semiconductor packages
• Design and execute experiments on materials and packaging or system structures to validate performance and inform design decisions
• Develop risk evaluations for future Annapurna packages, providing data-driven recommendations that shape next-generation package designs
• Collaborate with Quality and Reliability, Package Design, Test, and System Design teams to optimize package architectures and resolve cross-functional technical challenges
• Communicate findings through clear documentation and design reviews, contributing to specifications and trade-off analyses that guide team decisions

Conhecimentos

Finite element simulations

Analytical modeling

Cross-functional collaboration

Documentation and design reviews

Materials and packaging design

Formação académica

Bachelor's degree in mechanical engineering or equivalent

Ferramentas

ANSYS

ABAQUS

COMSOL

FLOTHERM

ICEPACK

Descrição da oferta de emprego

Amazon Inc. (Annapurna Labs) is seeking a Thermal & Mechanical Engineer to design and optimize advanced semiconductor packages for data-center deployment.

You will lead finite element simulations and experiments, ensuring thermal and mechanical integrity across package stacks and systems. You will collaborate with Quality, Reliability, Package Design, Test, and System Design teams to drive robust architectures and data-driven decisions for next-generation products.