Distinguished Engineer — Advanced Packaging & 3DIC Design

Synopsys, Inc.; Mountain View (CA); On-site; USD 250,000 - 400,000; Full time

Benefits offered by this job

Health benefits

Competitive compensation

Job summary

Synopsys invites a Distinguished Engineer to lead advanced packaging design automation within the 3DIC Compiler platform. You will shape substrate architectures for multi-die systems and drive performance-focused software across AI and HPC workloads.

You will mentor engineers, influence product direction, and collaborate with customers and R&D to deliver scalable, production-grade solutions for next-generation package substrates.

Qualifications

• Deep expertise in advanced packaging or package substrate design, routing, power delivery, and manufacturability.
• Proven experience building production software products at scale.
• Strong algorithmic foundation for physical design automation challenges.
• Expert-level C/C++ skills for performance-critical, large-scale systems.
• Experience in related domains: IC design automation, auto-routing, physical verification, or substrate design tools.
• Track record of technical leadership through architecture ownership, product influence, publications, or patents.

Responsibilities

• Architect and drive package substrate design automation capabilities within the 3DIC Compiler platform.
• Design and implement production-grade algorithms for HDI substrate auto-routing, design rule checking, power delivery network analysis, and design for manufacturability.
• Build scalable C/C++ software for advanced packaging designs, including multi-die chiplets and heterogeneous integration.
• Partner with customers, product teams, and R&D to translate design bottlenecks into durable technical solutions.
• Lead architecture reviews and influence technical decisions across the 3DIC product portfolio.
• Mentor engineers and raise the bar on algorithmic rigor, performance, and software quality.

Skills

Advanced packaging

C/C++

Algorithms

Leadership

Education

Advanced degree in Computer Science or Electrical Engineering

Tools

3DIC Compiler

Job description

Synopsys invites a Distinguished Engineer to lead advanced packaging design automation within the 3DIC Compiler platform. You will shape substrate architectures for multi-die systems and drive performance-focused software across AI and HPC workloads.

You will mentor engineers, influence product direction, and collaborate with customers and R&D to deliver scalable, production-grade solutions for next-generation package substrates.