Senior Spacecraft Electronics Packaging Analyst

Blue Origin; Denver (CO); On-site; USD 134,000 - 187,000; Full time

Benefits offered by this job

Medical, dental, vision

401(k) with company match

Paid time off

Stock options

Job summary

Blue Origin seeks a Senior Structural Analyst - Electronics Packaging to own the structural integrity of LRUs, avionics enclosures, and electronics assemblies from concept through production release. You will collaborate with mechanical design, electrical, thermal, and test teams to ensure lightweight, robust hardware for high-rate satellite deployment.

The role requires 8+ years in aerospace structural analysis, strong FEA proficiency, and experience with avionics packaging and qualification

Qualifications

• Bachelor's degree in Mechanical, Aerospace, Structural Engineering, or related field.
• 8+ years of structural analysis in aerospace/high-reliability hardware.
• Experience analyzing avionics, electronics packaging, enclosures, LRUs, PCBAs, or similar hardware.
• Proficiency with FEA tools (NASTRAN/ANSYS/Abaqus/FEMAP/HyperMesh).
• Strong knowledge of bolted joints, fasteners, brackets, plates, beams, loads, fatigue.

Responsibilities

• Own structural analysis for LRUs, avionics enclosures, electronics assemblies, and power electronics from concept to production release.
• Analyze packaging hardware including chassis, covers, and mounting interfaces.
• Build and maintain detailed FEA models using established tools.
• Verify strength, stiffness, modal response, vibration, shock, fatigue, and thermal-mechanical performance.

Skills

FEA Tools

Aerospace Experience

Vibration Analysis

Structural Analysis

Education

Bachelor's degree in Mechanical/Aerospace

Tools

NASTRAN

ANSYS

Abaqus

FEMAP

HyperMesh

Job description

Blue Origin seeks a Senior Structural Analyst - Electronics Packaging to own the structural integrity of LRUs, avionics enclosures, and electronics assemblies from concept through production release. You will collaborate with mechanical design, electrical, thermal, and test teams to ensure lightweight, robust hardware for high-rate satellite deployment.

The role requires 8+ years in aerospace structural analysis, strong FEA proficiency, and experience with avionics packaging and qualification