Lead Satellite Electronics Packaging Structural Analyst

Blue Origin LLC; United States; On-site; USD 134,000 - 203,000; Full time

Benefits offered by this job

Medical insurance

Stock options

Paid time off

Parental leave

Job summary

Blue Origin is seeking a Senior Structural Analyst – Electronics Packaging to own structural analysis for TeraWave LRUs, avionics enclosures, and electronics assemblies, ensuring structural integrity through concept to production release.

You will analyze chassis, PCBAs, connectors, and internal supports using FEA tools, validating strength, stiffness, and load paths while collaborating across design, electrical, thermal, manufacturing, and test teams.

Qualifications

• Bachelor's degree in Mechanical, Aerospace, Structural Engineering, or related field.
• 8+ years of structural analysis experience with aerospace, spacecraft, launch vehicle, defense, or high-reliability hardware.
• Experience analyzing avionics, electronics packaging, enclosures, LRUs, PCBAs, or similar hardware for vibration, shock, and thermal environments.
• Proficiency with FEA tools such as NASTRAN, ANSYS, Abaqus, FEMAP, HyperMesh, or equivalent.
• Strong knowledge of classical structural analysis, including bolted joints, fasteners, brackets, plates, beams, inserts, load paths, margins, and fatigue.
• Experience with dynamic environments, including modal, random vibration, sine vibration, and shock.
• Experience supporting qualification or acceptance testing, including planning, instrumentation, data review, model correlation, and anomaly resolution.
• Must be a U.S. citizen or national, U.S. permanent resident (current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

Responsibilities

• Own structural analysis for TeraWave satellite LRUs, avionics enclosures, electronics assemblies, and power electronics from concept through qualification and production release.
• Analyze electronics packaging hardware, including chassis, covers, mounting interfaces, card guides, wedge locks, fasteners, brackets, connectors, PCBAs/CCAs, and internal supports.
• Build and maintain detailed FEA and simplified analytical models using NASTRAN, ANSYS, Abaqus, or equivalent tools.
• Verify strength, stiffness, modal response, vibration, shock, fatigue, thermal-mechanical performance, and load paths using FEA and classical methods such as Steinberg or Engelmaier.
• Define structural environments, assumptions, boundary conditions, and interface loads with structures, systems, design, and test teams.
• Assess margins of safety for enclosures, bolted joints, inserts, card retention features, solder joints, components, connectors, and mounting feet.
• Support packaging trades for mass, stiffness, manufacturability, access, connector placement, card retention, and robustness.
• Partner with mechanical design engineers to drive structural requirements into enclosure design, PCB layout, component placement, and mounting strategy.

Skills

FEA analysis

Nastran/ANSYS

Structural analysis

Aerospace hardware

Python scripting

Team mentorship

Education

Bachelor's degree in Mechanical/Aerospace/Structural Engineering

Master's degree

Tools

Creo

Windchill

NX

SolidWorks

Teamcenter

FEMAP

HyperMesh

Job description

Blue Origin is seeking a Senior Structural Analyst – Electronics Packaging to own structural analysis for TeraWave LRUs, avionics enclosures, and electronics assemblies, ensuring structural integrity through concept to production release.

You will analyze chassis, PCBAs, connectors, and internal supports using FEA tools, validating strength, stiffness, and load paths while collaborating across design, electrical, thermal, manufacturing, and test teams.