Senior Electronics Packaging Structural Analyst

Blue Origin; Seattle (WA); On-site; USD 134,000 - 187,000; Full time

Benefits offered by this job

Medical insurance

Dental insurance

Vision insurance

401(k) with company match

Paid time off

Stock options

Parental leave

Job summary

Blue Origin in Seattle is seeking a Senior Structural Analyst – Electronics Packaging to own the structural analysis for TeraWave LRUs, avionics enclosures, and electronics assemblies from concept through qualification and production release. You will work with mechanical, electrical, thermal, manufacturing, test teams to ensure robust, lightweight hardware for high‑rate constellation deployment.

Preferred candidates have aerospace packaging experience and proficiency with FEA tools; strong

Qualifications

• Bachelor’s degree in Mechanical, Aerospace, Structural Engineering or related field.
• 8+ years of structural analysis experience with aerospace or high‑reliability hardware.
• Experience analyzing avionics, enclosures, LRUs, PCBs/CCAs for vibration, shock and thermal environments.
• Proficiency with FEA tools (NASTRAN/ANSYS/Abaqus) and strong knowledge of classical structural analysis.
• Ability to collaborate across design, electrical, thermal, manufacturing, systems and test teams.

Responsibilities

• Own structural analysis for TeraWave LRUs, avionics enclosures, electronics assemblies, and power electronics from concept through qualification and production release.
• Analyze electronics packaging hardware including chassis, covers, mounting interfaces, card guides, fasteners, brackets, connectors, PCBAs/CCAs, and internal supports.
• Build and maintain detailed FEA models using NASTRAN, ANSYS, Abaqus or equivalent tools.
• Verify strength, stiffness, modal response, vibration, shock, fatigue, and thermal‑mechanical performance with FEA and classical methods.
• Define structural environments, boundary conditions, and interface loads with teams; assess margins of safety.
• Mentor junior analysts and design engineers in electronics packaging analysis methods.

Skills

Structural analysis

FEA tools

Aerospace packaging

Collaboration across teams

Mentoring

Education

Bachelor's degree in Mechanical, Aerospace, Structural Engineering

Master's degree (preferred)

Tools

NASTRAN

ANSYS

Abaqus

FEMAP

HyperMesh

Job description

Blue Origin in Seattle is seeking a Senior Structural Analyst – Electronics Packaging to own the structural analysis for TeraWave LRUs, avionics enclosures, and electronics assemblies from concept through qualification and production release. You will work with mechanical, electrical, thermal, manufacturing, test teams to ensure robust, lightweight hardware for high‑rate constellation deployment.

Preferred candidates have aerospace packaging experience and proficiency with FEA tools; strong